Cost-Effective RF Front-End Module Using High Q Passive Components on Liquid Crystal Polymer Substrates and Micro-BGA

Stephane PINEL; Mekita F. DAVIS; Venky SUNDARAM; Kyutae LIM; Joy LASKAR; George WHITE; Rao R. TUMMALA

Cost-Effective RF Front-End Module Using High Q Passive Components on Liquid Crystal Polymer Substrates and Micro-BGA

Stephane PINEL, Mekita F. DAVIS, Venky SUNDARAM, Kyutae LIM, Joy LASKAR, George WHITE, Rao R. TUMMALA

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Electronics packaging evolution involves both systems, technology & materials considerations. In this paper, we present a novel 3D integration approach for system-on-package (SOP) based solutions for wireless communication applications. This concept is proposed for the 3D integration of a C band Wireless LAN (WLAN) RF front-end module by means of stacking LCP (Liquid Crystal Polymer) substrates using µBGA technology. LCP substrates fabrication, high Q inductor design and the associated physical based modeling are detailed. Then stacking techniques using µBGA technology is presented. Characterization and modeling of RF vertical board-to-board transition, using µBGA process are detailed and show that this vertical transition is suitable for C-band wireless communication applications.

Publication: IEICE TRANSACTIONS on Electronics Vol.E86-C No.8 pp.1584-1592

Publication Date: 2003/08/01

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Type of Manuscript: Special Section PAPER (Special Issue on Microwave and Millimeter Wave Technology)

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Stephane PINEL, Mekita F. DAVIS, Venky SUNDARAM, Kyutae LIM, Joy LASKAR, George WHITE, Rao R. TUMMALA, "Cost-Effective RF Front-End Module Using High Q Passive Components on Liquid Crystal Polymer Substrates and Micro-BGA" in IEICE TRANSACTIONS on Electronics, vol. E86-C, no. 8, pp. 1584-1592, August 2003, doi: .
Abstract: Electronics packaging evolution involves both systems, technology & materials considerations. In this paper, we present a novel 3D integration approach for system-on-package (SOP) based solutions for wireless communication applications. This concept is proposed for the 3D integration of a C band Wireless LAN (WLAN) RF front-end module by means of stacking LCP (Liquid Crystal Polymer) substrates using µBGA technology. LCP substrates fabrication, high Q inductor design and the associated physical based modeling are detailed. Then stacking techniques using µBGA technology is presented. Characterization and modeling of RF vertical board-to-board transition, using µBGA process are detailed and show that this vertical transition is suitable for C-band wireless communication applications.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e86-c_8_1584/_p

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@ARTICLE{e86-c_8_1584,
author={Stephane PINEL, Mekita F. DAVIS, Venky SUNDARAM, Kyutae LIM, Joy LASKAR, George WHITE, Rao R. TUMMALA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Cost-Effective RF Front-End Module Using High Q Passive Components on Liquid Crystal Polymer Substrates and Micro-BGA},
year={2003},
volume={E86-C},
number={8},
pages={1584-1592},
abstract={Electronics packaging evolution involves both systems, technology & materials considerations. In this paper, we present a novel 3D integration approach for system-on-package (SOP) based solutions for wireless communication applications. This concept is proposed for the 3D integration of a C band Wireless LAN (WLAN) RF front-end module by means of stacking LCP (Liquid Crystal Polymer) substrates using µBGA technology. LCP substrates fabrication, high Q inductor design and the associated physical based modeling are detailed. Then stacking techniques using µBGA technology is presented. Characterization and modeling of RF vertical board-to-board transition, using µBGA process are detailed and show that this vertical transition is suitable for C-band wireless communication applications.},
keywords={},
doi={},
ISSN={},
month={August},}

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TY - JOUR
TI - Cost-Effective RF Front-End Module Using High Q Passive Components on Liquid Crystal Polymer Substrates and Micro-BGA
T2 - IEICE TRANSACTIONS on Electronics
SP - 1584
EP - 1592
AU - Stephane PINEL
AU - Mekita F. DAVIS
AU - Venky SUNDARAM
AU - Kyutae LIM
AU - Joy LASKAR
AU - George WHITE
AU - Rao R. TUMMALA
PY - 2003
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E86-C
IS - 8
JA - IEICE TRANSACTIONS on Electronics
Y1 - August 2003
AB - Electronics packaging evolution involves both systems, technology & materials considerations. In this paper, we present a novel 3D integration approach for system-on-package (SOP) based solutions for wireless communication applications. This concept is proposed for the 3D integration of a C band Wireless LAN (WLAN) RF front-end module by means of stacking LCP (Liquid Crystal Polymer) substrates using µBGA technology. LCP substrates fabrication, high Q inductor design and the associated physical based modeling are detailed. Then stacking techniques using µBGA technology is presented. Characterization and modeling of RF vertical board-to-board transition, using µBGA process are detailed and show that this vertical transition is suitable for C-band wireless communication applications.
ER -