IEICE TRANSACTIONS on Electronics
Numerical Analysis of the Effect of Thin-Film Thickness and Material in Field Mapping of Eddy-Current Probes Using Photoinductive Technique
Summary :
Numerical analysis of the photoinductive (PI) field mapping technique for characterizing the eddy-current (EC) probes with tilted coils above a thin metal film was investigated using a two-dimensional transient finite element method (FEM). We apply the FEM model of PI method to observe the influence of metal film materials on the field-mapping images used to characterize EC probes. The effects of film thickness on the PI mapping signal are also shown and discussed. The simulation results using the proposed model showed that the PI signals largely depend on the thermal conductivity and the thickness of the thin metal film. The field-mapping signals using the appropriate actual metal film material for EC probe coil with 0°, 5°, 10°, 15°, and 20° tilt angle are also examined. We demonstrate that the higher resolution in field-mapping images of commercial EC probes can be obtained by given higher thermal conductivity and thinner thickness of metal film. The fundamental understanding of distinct field distribution will aid in the selection of the higher-quality EC probe for accurate inspection with EC testing.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E95-C No.1 pp.86-92
- Publication Date
- 2012/01/01
- Publicized
- Online ISSN
- 1745-1353
- DOI
- 10.1587/transele.E95.C.86
- Type of Manuscript
- Special Section PAPER (Special Section on Recent Progress in Electromagnetic Theory and Its Application)
- Category
- Numerical Techniques
Authors
Keyword
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Yen-Lin PAN, Cheng-Chi TAI, Dong-Shong LIANG, "Numerical Analysis of the Effect of Thin-Film Thickness and Material in Field Mapping of Eddy-Current Probes Using Photoinductive Technique" in IEICE TRANSACTIONS on Electronics,
vol. E95-C, no. 1, pp. 86-92, January 2012, doi: 10.1587/transele.E95.C.86.
Abstract: Numerical analysis of the photoinductive (PI) field mapping technique for characterizing the eddy-current (EC) probes with tilted coils above a thin metal film was investigated using a two-dimensional transient finite element method (FEM). We apply the FEM model of PI method to observe the influence of metal film materials on the field-mapping images used to characterize EC probes. The effects of film thickness on the PI mapping signal are also shown and discussed. The simulation results using the proposed model showed that the PI signals largely depend on the thermal conductivity and the thickness of the thin metal film. The field-mapping signals using the appropriate actual metal film material for EC probe coil with 0°, 5°, 10°, 15°, and 20° tilt angle are also examined. We demonstrate that the higher resolution in field-mapping images of commercial EC probes can be obtained by given higher thermal conductivity and thinner thickness of metal film. The fundamental understanding of distinct field distribution will aid in the selection of the higher-quality EC probe for accurate inspection with EC testing.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/transele.E95.C.86/_p
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@ARTICLE{e95-c_1_86,
author={Yen-Lin PAN, Cheng-Chi TAI, Dong-Shong LIANG, },
journal={IEICE TRANSACTIONS on Electronics},
title={Numerical Analysis of the Effect of Thin-Film Thickness and Material in Field Mapping of Eddy-Current Probes Using Photoinductive Technique},
year={2012},
volume={E95-C},
number={1},
pages={86-92},
abstract={Numerical analysis of the photoinductive (PI) field mapping technique for characterizing the eddy-current (EC) probes with tilted coils above a thin metal film was investigated using a two-dimensional transient finite element method (FEM). We apply the FEM model of PI method to observe the influence of metal film materials on the field-mapping images used to characterize EC probes. The effects of film thickness on the PI mapping signal are also shown and discussed. The simulation results using the proposed model showed that the PI signals largely depend on the thermal conductivity and the thickness of the thin metal film. The field-mapping signals using the appropriate actual metal film material for EC probe coil with 0°, 5°, 10°, 15°, and 20° tilt angle are also examined. We demonstrate that the higher resolution in field-mapping images of commercial EC probes can be obtained by given higher thermal conductivity and thinner thickness of metal film. The fundamental understanding of distinct field distribution will aid in the selection of the higher-quality EC probe for accurate inspection with EC testing.},
keywords={},
doi={10.1587/transele.E95.C.86},
ISSN={1745-1353},
month={January},}
Copy
TY - JOUR
TI - Numerical Analysis of the Effect of Thin-Film Thickness and Material in Field Mapping of Eddy-Current Probes Using Photoinductive Technique
T2 - IEICE TRANSACTIONS on Electronics
SP - 86
EP - 92
AU - Yen-Lin PAN
AU - Cheng-Chi TAI
AU - Dong-Shong LIANG
PY - 2012
DO - 10.1587/transele.E95.C.86
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E95-C
IS - 1
JA - IEICE TRANSACTIONS on Electronics
Y1 - January 2012
AB - Numerical analysis of the photoinductive (PI) field mapping technique for characterizing the eddy-current (EC) probes with tilted coils above a thin metal film was investigated using a two-dimensional transient finite element method (FEM). We apply the FEM model of PI method to observe the influence of metal film materials on the field-mapping images used to characterize EC probes. The effects of film thickness on the PI mapping signal are also shown and discussed. The simulation results using the proposed model showed that the PI signals largely depend on the thermal conductivity and the thickness of the thin metal film. The field-mapping signals using the appropriate actual metal film material for EC probe coil with 0°, 5°, 10°, 15°, and 20° tilt angle are also examined. We demonstrate that the higher resolution in field-mapping images of commercial EC probes can be obtained by given higher thermal conductivity and thinner thickness of metal film. The fundamental understanding of distinct field distribution will aid in the selection of the higher-quality EC probe for accurate inspection with EC testing.
ER -
English
