IEICE TRANSACTIONS on Fundamentals
Quantitative Prediction of On-Chip Capacitive and Inductive Crosstalk Noise and Tradeoff between Wire Cross-Sectional Area and Inductive Crosstalk Effect
Summary :
Capacitive and inductive crosstalk noises are expected to be more serious in advanced technologies. However, capacitive and inductive crosstalk noises in the future have not been concurrently and sufficiently discussed quantitatively, though capacitive crosstalk noise has been intensively studied solely as a primary factor of interconnect delay variation. This paper quantitatively predicts the impact of capacitive and inductive crosstalk in prospective processes, and reveals that interconnect scaling strategies strongly affect relative dominance between capacitive and inductive coupling. Our prediction also makes the point that the interconnect resistance significantly influences both inductive coupling noise and propagation delay. We then evaluate a tradeoff between wire cross-sectional area and worst-case propagation delay focusing on inductive coupling noise, and show that an appropriate selection of wire cross-section can reduce delay uncertainty at the small sacrifice of propagation delay.
- Publication
- IEICE TRANSACTIONS on Fundamentals Vol.E90-A No.4 pp.724-731
- Publication Date
- 2007/04/01
- Publicized
- Online ISSN
- 1745-1337
- DOI
- 10.1093/ietfec/e90-a.4.724
- Type of Manuscript
- Special Section PAPER (Special Section on Selected Papers from the 19th Workshop on Circuits and Systems in Karuizawa)
- Category
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Yasuhiro OGASAHARA, Masanori HASHIMOTO, Takao ONOYE, "Quantitative Prediction of On-Chip Capacitive and Inductive Crosstalk Noise and Tradeoff between Wire Cross-Sectional Area and Inductive Crosstalk Effect" in IEICE TRANSACTIONS on Fundamentals,
vol. E90-A, no. 4, pp. 724-731, April 2007, doi: 10.1093/ietfec/e90-a.4.724.
Abstract: Capacitive and inductive crosstalk noises are expected to be more serious in advanced technologies. However, capacitive and inductive crosstalk noises in the future have not been concurrently and sufficiently discussed quantitatively, though capacitive crosstalk noise has been intensively studied solely as a primary factor of interconnect delay variation. This paper quantitatively predicts the impact of capacitive and inductive crosstalk in prospective processes, and reveals that interconnect scaling strategies strongly affect relative dominance between capacitive and inductive coupling. Our prediction also makes the point that the interconnect resistance significantly influences both inductive coupling noise and propagation delay. We then evaluate a tradeoff between wire cross-sectional area and worst-case propagation delay focusing on inductive coupling noise, and show that an appropriate selection of wire cross-section can reduce delay uncertainty at the small sacrifice of propagation delay.
URL: https://global.ieice.org/en_transactions/fundamentals/10.1093/ietfec/e90-a.4.724/_p
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@ARTICLE{e90-a_4_724,
author={Yasuhiro OGASAHARA, Masanori HASHIMOTO, Takao ONOYE, },
journal={IEICE TRANSACTIONS on Fundamentals},
title={Quantitative Prediction of On-Chip Capacitive and Inductive Crosstalk Noise and Tradeoff between Wire Cross-Sectional Area and Inductive Crosstalk Effect},
year={2007},
volume={E90-A},
number={4},
pages={724-731},
abstract={Capacitive and inductive crosstalk noises are expected to be more serious in advanced technologies. However, capacitive and inductive crosstalk noises in the future have not been concurrently and sufficiently discussed quantitatively, though capacitive crosstalk noise has been intensively studied solely as a primary factor of interconnect delay variation. This paper quantitatively predicts the impact of capacitive and inductive crosstalk in prospective processes, and reveals that interconnect scaling strategies strongly affect relative dominance between capacitive and inductive coupling. Our prediction also makes the point that the interconnect resistance significantly influences both inductive coupling noise and propagation delay. We then evaluate a tradeoff between wire cross-sectional area and worst-case propagation delay focusing on inductive coupling noise, and show that an appropriate selection of wire cross-section can reduce delay uncertainty at the small sacrifice of propagation delay.},
keywords={},
doi={10.1093/ietfec/e90-a.4.724},
ISSN={1745-1337},
month={April},}
Copy
TY - JOUR
TI - Quantitative Prediction of On-Chip Capacitive and Inductive Crosstalk Noise and Tradeoff between Wire Cross-Sectional Area and Inductive Crosstalk Effect
T2 - IEICE TRANSACTIONS on Fundamentals
SP - 724
EP - 731
AU - Yasuhiro OGASAHARA
AU - Masanori HASHIMOTO
AU - Takao ONOYE
PY - 2007
DO - 10.1093/ietfec/e90-a.4.724
JO - IEICE TRANSACTIONS on Fundamentals
SN - 1745-1337
VL - E90-A
IS - 4
JA - IEICE TRANSACTIONS on Fundamentals
Y1 - April 2007
AB - Capacitive and inductive crosstalk noises are expected to be more serious in advanced technologies. However, capacitive and inductive crosstalk noises in the future have not been concurrently and sufficiently discussed quantitatively, though capacitive crosstalk noise has been intensively studied solely as a primary factor of interconnect delay variation. This paper quantitatively predicts the impact of capacitive and inductive crosstalk in prospective processes, and reveals that interconnect scaling strategies strongly affect relative dominance between capacitive and inductive coupling. Our prediction also makes the point that the interconnect resistance significantly influences both inductive coupling noise and propagation delay. We then evaluate a tradeoff between wire cross-sectional area and worst-case propagation delay focusing on inductive coupling noise, and show that an appropriate selection of wire cross-section can reduce delay uncertainty at the small sacrifice of propagation delay.
ER -
English
