An Oscillation-Based On-Chip Temperature-Aware Dynamic Voltage and Frequency Scaling Scheme in System-on-a-Chip

Katherine Shu-Min LI; Yingchieh HO; Yu-Wei YANG; Liang-Bi CHEN

doi:10.1587/transinf.2013LOP0016

An Oscillation-Based On-Chip Temperature-Aware Dynamic Voltage and Frequency Scaling Scheme in System-on-a-Chip

Katherine Shu-Min LI, Yingchieh HO, Yu-Wei YANG, Liang-Bi CHEN

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The excessively high temperature in a chip may cause circuit malfunction and performance degradation, and thus should be avoided to improve system reliability. In this paper, a novel oscillation-based on-chip thermal sensing architecture for dynamically adjusting supply voltage and clock frequency in System-on-a-Chip (SoC) is proposed. It is shown that the oscillation frequency of a ring oscillator reduces linearly as the temperature rises, and thus provides a good on-chip temperature sensing mechanism. An efficient Dynamic Voltage-to-Frequency Scaling (DF2VS) algorithm is proposed to dynamically adjust supply voltage according to the oscillation frequencies of the ring oscillators distributed in SoC so that thermal sensing can be carried at all potential hot spots. An on-chip Dynamic Voltage Scaling or Dynamic Voltage and Frequency Scaling (DVS or DVFS) monitor selects the supply voltage level and clock frequency according to the outputs of all thermal sensors. Experimental results on SoC benchmark circuits show the effectiveness of the algorithm that a 10% reduction in supply voltage alone can achieve about 20% power reduction (DVS scheme), and nearly 50% reduction in power is achievable if the clock frequency is also scaled down (DVFS scheme). The chip temperature will be significant lower due to the reduced power consumption.

Publication: IEICE TRANSACTIONS on Information Vol.E97-D No.9 pp.2320-2329

Publication Date: 2014/09/01

Publicized

Online ISSN: 1745-1361

DOI: 10.1587/transinf.2013LOP0016

Type of Manuscript: Special Section PAPER (Special Section on Multiple-Valued Logic and VLSI Computing)

Category: Circuit Implementations

Authors

Katherine Shu-Min LI
  National Sun Yat-Sen University
Yingchieh HO
  National Dong-Hwa University
Yu-Wei YANG
  National Sun Yat-Sen University
Liang-Bi CHEN
  National Sun Yat-Sen University

Keyword

DVFS, measurement and simulation of multiple-processor (multicores, PSoC) systems, real-time distributed systems, reliability, thermal effect control scheme

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Katherine Shu-Min LI, Yingchieh HO, Yu-Wei YANG, Liang-Bi CHEN, "An Oscillation-Based On-Chip Temperature-Aware Dynamic Voltage and Frequency Scaling Scheme in System-on-a-Chip" in IEICE TRANSACTIONS on Information, vol. E97-D, no. 9, pp. 2320-2329, September 2014, doi: 10.1587/transinf.2013LOP0016.
Abstract: The excessively high temperature in a chip may cause circuit malfunction and performance degradation, and thus should be avoided to improve system reliability. In this paper, a novel oscillation-based on-chip thermal sensing architecture for dynamically adjusting supply voltage and clock frequency in System-on-a-Chip (SoC) is proposed. It is shown that the oscillation frequency of a ring oscillator reduces linearly as the temperature rises, and thus provides a good on-chip temperature sensing mechanism. An efficient Dynamic Voltage-to-Frequency Scaling (DF2VS) algorithm is proposed to dynamically adjust supply voltage according to the oscillation frequencies of the ring oscillators distributed in SoC so that thermal sensing can be carried at all potential hot spots. An on-chip Dynamic Voltage Scaling or Dynamic Voltage and Frequency Scaling (DVS or DVFS) monitor selects the supply voltage level and clock frequency according to the outputs of all thermal sensors. Experimental results on SoC benchmark circuits show the effectiveness of the algorithm that a 10% reduction in supply voltage alone can achieve about 20% power reduction (DVS scheme), and nearly 50% reduction in power is achievable if the clock frequency is also scaled down (DVFS scheme). The chip temperature will be significant lower due to the reduced power consumption.
URL: https://global.ieice.org/en_transactions/information/10.1587/transinf.2013LOP0016/_p

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@ARTICLE{e97-d_9_2320,
author={Katherine Shu-Min LI, Yingchieh HO, Yu-Wei YANG, Liang-Bi CHEN, },
journal={IEICE TRANSACTIONS on Information},
title={An Oscillation-Based On-Chip Temperature-Aware Dynamic Voltage and Frequency Scaling Scheme in System-on-a-Chip},
year={2014},
volume={E97-D},
number={9},
pages={2320-2329},
abstract={The excessively high temperature in a chip may cause circuit malfunction and performance degradation, and thus should be avoided to improve system reliability. In this paper, a novel oscillation-based on-chip thermal sensing architecture for dynamically adjusting supply voltage and clock frequency in System-on-a-Chip (SoC) is proposed. It is shown that the oscillation frequency of a ring oscillator reduces linearly as the temperature rises, and thus provides a good on-chip temperature sensing mechanism. An efficient Dynamic Voltage-to-Frequency Scaling (DF2VS) algorithm is proposed to dynamically adjust supply voltage according to the oscillation frequencies of the ring oscillators distributed in SoC so that thermal sensing can be carried at all potential hot spots. An on-chip Dynamic Voltage Scaling or Dynamic Voltage and Frequency Scaling (DVS or DVFS) monitor selects the supply voltage level and clock frequency according to the outputs of all thermal sensors. Experimental results on SoC benchmark circuits show the effectiveness of the algorithm that a 10% reduction in supply voltage alone can achieve about 20% power reduction (DVS scheme), and nearly 50% reduction in power is achievable if the clock frequency is also scaled down (DVFS scheme). The chip temperature will be significant lower due to the reduced power consumption.},
keywords={},
doi={10.1587/transinf.2013LOP0016},
ISSN={1745-1361},
month={September},}

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TY - JOUR
TI - An Oscillation-Based On-Chip Temperature-Aware Dynamic Voltage and Frequency Scaling Scheme in System-on-a-Chip
T2 - IEICE TRANSACTIONS on Information
SP - 2320
EP - 2329
AU - Katherine Shu-Min LI
AU - Yingchieh HO
AU - Yu-Wei YANG
AU - Liang-Bi CHEN
PY - 2014
DO - 10.1587/transinf.2013LOP0016
JO - IEICE TRANSACTIONS on Information
SN - 1745-1361
VL - E97-D
IS - 9
JA - IEICE TRANSACTIONS on Information
Y1 - September 2014
AB - The excessively high temperature in a chip may cause circuit malfunction and performance degradation, and thus should be avoided to improve system reliability. In this paper, a novel oscillation-based on-chip thermal sensing architecture for dynamically adjusting supply voltage and clock frequency in System-on-a-Chip (SoC) is proposed. It is shown that the oscillation frequency of a ring oscillator reduces linearly as the temperature rises, and thus provides a good on-chip temperature sensing mechanism. An efficient Dynamic Voltage-to-Frequency Scaling (DF2VS) algorithm is proposed to dynamically adjust supply voltage according to the oscillation frequencies of the ring oscillators distributed in SoC so that thermal sensing can be carried at all potential hot spots. An on-chip Dynamic Voltage Scaling or Dynamic Voltage and Frequency Scaling (DVS or DVFS) monitor selects the supply voltage level and clock frequency according to the outputs of all thermal sensors. Experimental results on SoC benchmark circuits show the effectiveness of the algorithm that a 10% reduction in supply voltage alone can achieve about 20% power reduction (DVS scheme), and nearly 50% reduction in power is achievable if the clock frequency is also scaled down (DVFS scheme). The chip temperature will be significant lower due to the reduced power consumption.
ER -