On the Usefulness of Additional Vias in Multilayer Printed Wiring Boards
Summary :
The cost trade-off between the number of additional vias employed and the number of layers decreased in Ref.(2) is discussed. We present a cost model and show that the technique in Ref.(2) really reduce the total cost for producing the board.
- Publication
- IEICE TRANSACTIONS on transactions Vol.E71-E No.11 pp.1091-1094
- Publication Date
- 1988/11/25
- Publicized
- Online ISSN
- DOI
- Type of Manuscript
- LETTER
- Category
- Computer Hardware and Design
Authors
Keyword
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Mohsen GHAMESHLU, Noriyoshi YOSHIDA, "On the Usefulness of Additional Vias in Multilayer Printed Wiring Boards" in IEICE TRANSACTIONS on transactions,
vol. E71-E, no. 11, pp. 1091-1094, November 1988, doi: .
Abstract: The cost trade-off between the number of additional vias employed and the number of layers decreased in Ref.(2) is discussed. We present a cost model and show that the technique in Ref.(2) really reduce the total cost for producing the board.
URL: https://global.ieice.org/en_transactions/transactions/10.1587/e71-e_11_1091/_p
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@ARTICLE{e71-e_11_1091,
author={Mohsen GHAMESHLU, Noriyoshi YOSHIDA, },
journal={IEICE TRANSACTIONS on transactions},
title={On the Usefulness of Additional Vias in Multilayer Printed Wiring Boards},
year={1988},
volume={E71-E},
number={11},
pages={1091-1094},
abstract={The cost trade-off between the number of additional vias employed and the number of layers decreased in Ref.(2) is discussed. We present a cost model and show that the technique in Ref.(2) really reduce the total cost for producing the board.},
keywords={},
doi={},
ISSN={},
month={November},}
Copy
TY - JOUR
TI - On the Usefulness of Additional Vias in Multilayer Printed Wiring Boards
T2 - IEICE TRANSACTIONS on transactions
SP - 1091
EP - 1094
AU - Mohsen GHAMESHLU
AU - Noriyoshi YOSHIDA
PY - 1988
DO -
JO - IEICE TRANSACTIONS on transactions
SN -
VL - E71-E
IS - 11
JA - IEICE TRANSACTIONS on transactions
Y1 - November 1988
AB - The cost trade-off between the number of additional vias employed and the number of layers decreased in Ref.(2) is discussed. We present a cost model and show that the technique in Ref.(2) really reduce the total cost for producing the board.
ER -
English
