IEICE TRANSACTIONS on transactions
Progress of H2S Gas Corrosion and Contact Resistance Properties for Contact Surface of Printed Circuit Board
Summary :
Progress of corrosion of contact surfaces on the printed circuit board both for thin Au plated (0.1µm) and for thick solder plated (10µm) were examined in H2S environment. The corrosion was evaluated by thickness of contaminant film and contact resistance. The Au plated surface easily degraded by pore corrosion. On the other hand, the film on the solder plated surface grew very slowly. For the solder plated surface, acceptable low contact resistance which corresponds to the low growth rate of the film was found.
- Publication
- IEICE TRANSACTIONS on transactions Vol.E73-E No.4 pp.499-502
- Publication Date
- 1990/04/25
- Publicized
- Online ISSN
- DOI
- Type of Manuscript
- Special Section LETTER (Special Issue on 1990 Spring National Convention IEICE)
- Category
- Electromechanical Components
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Keyword
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Terutaka TAMAI, Tsunemi MORIYA, "Progress of H2S Gas Corrosion and Contact Resistance Properties for Contact Surface of Printed Circuit Board" in IEICE TRANSACTIONS on transactions,
vol. E73-E, no. 4, pp. 499-502, April 1990, doi: .
Abstract: Progress of corrosion of contact surfaces on the printed circuit board both for thin Au plated (0.1µm) and for thick solder plated (10µm) were examined in H2S environment. The corrosion was evaluated by thickness of contaminant film and contact resistance. The Au plated surface easily degraded by pore corrosion. On the other hand, the film on the solder plated surface grew very slowly. For the solder plated surface, acceptable low contact resistance which corresponds to the low growth rate of the film was found.
URL: https://global.ieice.org/en_transactions/transactions/10.1587/e73-e_4_499/_p
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@ARTICLE{e73-e_4_499,
author={Terutaka TAMAI, Tsunemi MORIYA, },
journal={IEICE TRANSACTIONS on transactions},
title={Progress of H2S Gas Corrosion and Contact Resistance Properties for Contact Surface of Printed Circuit Board},
year={1990},
volume={E73-E},
number={4},
pages={499-502},
abstract={Progress of corrosion of contact surfaces on the printed circuit board both for thin Au plated (0.1µm) and for thick solder plated (10µm) were examined in H2S environment. The corrosion was evaluated by thickness of contaminant film and contact resistance. The Au plated surface easily degraded by pore corrosion. On the other hand, the film on the solder plated surface grew very slowly. For the solder plated surface, acceptable low contact resistance which corresponds to the low growth rate of the film was found.},
keywords={},
doi={},
ISSN={},
month={April},}
Copy
TY - JOUR
TI - Progress of H2S Gas Corrosion and Contact Resistance Properties for Contact Surface of Printed Circuit Board
T2 - IEICE TRANSACTIONS on transactions
SP - 499
EP - 502
AU - Terutaka TAMAI
AU - Tsunemi MORIYA
PY - 1990
DO -
JO - IEICE TRANSACTIONS on transactions
SN -
VL - E73-E
IS - 4
JA - IEICE TRANSACTIONS on transactions
Y1 - April 1990
AB - Progress of corrosion of contact surfaces on the printed circuit board both for thin Au plated (0.1µm) and for thick solder plated (10µm) were examined in H2S environment. The corrosion was evaluated by thickness of contaminant film and contact resistance. The Au plated surface easily degraded by pore corrosion. On the other hand, the film on the solder plated surface grew very slowly. For the solder plated surface, acceptable low contact resistance which corresponds to the low growth rate of the film was found.
ER -
English
