A Study of Contact Failure Mechanism at Low Electrical Load
Summary :
Communication relays have been used for the control of low level circuits, and organic gases vaporized from relays or contamination of contact surface were studied as the factors lowering contact reliability so far. Conversely, contact materials of platinum group contacts like palladium and gold or silver alloy contacts were mainly evaluated as reliable contacts. Authors tried to clarify the contact failure mechanism of gold or silver alloy contacts at a extremely low electrical load which had minimal switching electrical energy. As a result, the oxides are detected from contact failure samples by the contact surface analysis, which suggests a small amount of impure substances in the gold alloy causes contact resistance increase. In addition, the influence of the ratio of oxygen and nitrogen on contact resistance was investigated. Then the contact failure has not occurred below 0.1% of oxygen concentration. As for some contact materials, the permissible contact force was also studied.
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- IEICE TRANSACTIONS on transactions Vol.E73-E No.6 pp.973-977
- Publication Date
- 1990/06/25
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- PAPER
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- Components
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Kazuhisa YOSHIDA, Akira MOTOYAMA, "A Study of Contact Failure Mechanism at Low Electrical Load" in IEICE TRANSACTIONS on transactions,
vol. E73-E, no. 6, pp. 973-977, June 1990, doi: .
Abstract: Communication relays have been used for the control of low level circuits, and organic gases vaporized from relays or contamination of contact surface were studied as the factors lowering contact reliability so far. Conversely, contact materials of platinum group contacts like palladium and gold or silver alloy contacts were mainly evaluated as reliable contacts. Authors tried to clarify the contact failure mechanism of gold or silver alloy contacts at a extremely low electrical load which had minimal switching electrical energy. As a result, the oxides are detected from contact failure samples by the contact surface analysis, which suggests a small amount of impure substances in the gold alloy causes contact resistance increase. In addition, the influence of the ratio of oxygen and nitrogen on contact resistance was investigated. Then the contact failure has not occurred below 0.1% of oxygen concentration. As for some contact materials, the permissible contact force was also studied.
URL: https://global.ieice.org/en_transactions/transactions/10.1587/e73-e_6_973/_p
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@ARTICLE{e73-e_6_973,
author={Kazuhisa YOSHIDA, Akira MOTOYAMA, },
journal={IEICE TRANSACTIONS on transactions},
title={A Study of Contact Failure Mechanism at Low Electrical Load},
year={1990},
volume={E73-E},
number={6},
pages={973-977},
abstract={Communication relays have been used for the control of low level circuits, and organic gases vaporized from relays or contamination of contact surface were studied as the factors lowering contact reliability so far. Conversely, contact materials of platinum group contacts like palladium and gold or silver alloy contacts were mainly evaluated as reliable contacts. Authors tried to clarify the contact failure mechanism of gold or silver alloy contacts at a extremely low electrical load which had minimal switching electrical energy. As a result, the oxides are detected from contact failure samples by the contact surface analysis, which suggests a small amount of impure substances in the gold alloy causes contact resistance increase. In addition, the influence of the ratio of oxygen and nitrogen on contact resistance was investigated. Then the contact failure has not occurred below 0.1% of oxygen concentration. As for some contact materials, the permissible contact force was also studied.},
keywords={},
doi={},
ISSN={},
month={June},}
Copy
TY - JOUR
TI - A Study of Contact Failure Mechanism at Low Electrical Load
T2 - IEICE TRANSACTIONS on transactions
SP - 973
EP - 977
AU - Kazuhisa YOSHIDA
AU - Akira MOTOYAMA
PY - 1990
DO -
JO - IEICE TRANSACTIONS on transactions
SN -
VL - E73-E
IS - 6
JA - IEICE TRANSACTIONS on transactions
Y1 - June 1990
AB - Communication relays have been used for the control of low level circuits, and organic gases vaporized from relays or contamination of contact surface were studied as the factors lowering contact reliability so far. Conversely, contact materials of platinum group contacts like palladium and gold or silver alloy contacts were mainly evaluated as reliable contacts. Authors tried to clarify the contact failure mechanism of gold or silver alloy contacts at a extremely low electrical load which had minimal switching electrical energy. As a result, the oxides are detected from contact failure samples by the contact surface analysis, which suggests a small amount of impure substances in the gold alloy causes contact resistance increase. In addition, the influence of the ratio of oxygen and nitrogen on contact resistance was investigated. Then the contact failure has not occurred below 0.1% of oxygen concentration. As for some contact materials, the permissible contact force was also studied.
ER -
English
