Sophisticated packging technology and up-to-date semiconductor technology are the key to increase system performance. The use of high density packaging technology such as polyimide-ceramic super substrate, ultra small outline chip carrier FTC (Flipped TAB Carrier) and higher thermal conductive LCM (Liquid Cooling Module) has mainly contributed to the system performance. These packaging technologies are based upon the basic concept of PoweryTime Product Theory and Media Delay Factor. This paper introduces above basical theory and shows the packaging technologies which have been used for the NEC's super computers.

The packaging hierarchy is not fixed structure. It can be changed depending on the packaging technology itself, and the number of hierarchy levels tends to decrease. In LSI-package technology including package-to-board interconnections, there were two evolutionary changes. The first evolution was from PTH to SMT, and the second evolution was from "Peripheral connections" to "Area-array connections. " These evolutions have been caused by ICs integration and application products requirements. Now, the third evolution appears to be in progress, which is from SCP to MCP or SIP. Although SoC has many remarkable features, it has been not applied for many systems contrary to expectations, and its limitations or issues have become clear. SIP is the answer for above SoC's issues. MCP can be considered to be primitive SIP. The purpose of MCP is making up the technology gap between SMT and SoC to address the issues. The targets of SIP are mainly the next two items. (1) Overcoming the interconnection crisis of SoC. (2) Opening new application fields in electronics. In order to achieve those targets, several consortiums in the world are doing research and developing core technologies.