High Performance Packaging Technology for Supercomputers
Summary :
Sophisticated packging technology and up-to-date semiconductor technology are the key to increase system performance. The use of high density packaging technology such as polyimide-ceramic super substrate, ultra small outline chip carrier FTC (Flipped TAB Carrier) and higher thermal conductive LCM (Liquid Cooling Module) has mainly contributed to the system performance. These packaging technologies are based upon the basic concept of Powery・Time Product Theory and Media Delay Factor. This paper introduces above basical theory and shows the packaging technologies which have been used for the NEC's super computers.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E74-C No.8 pp.2331-2336
- Publication Date
- 1991/08/25
- Publicized
- Online ISSN
- DOI
- Type of Manuscript
- Special Section PAPER (Special Issue on Advanced Packaging Technology for Microelectronics Manufacturing)
- Category
- Packaging Technology for Main Frame
Authors
Keyword
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Toshihiko WATARI, Akihiro DOHYA, "High Performance Packaging Technology for Supercomputers" in IEICE TRANSACTIONS on Electronics,
vol. E74-C, no. 8, pp. 2331-2336, August 1991, doi: .
Abstract: Sophisticated packging technology and up-to-date semiconductor technology are the key to increase system performance. The use of high density packaging technology such as polyimide-ceramic super substrate, ultra small outline chip carrier FTC (Flipped TAB Carrier) and higher thermal conductive LCM (Liquid Cooling Module) has mainly contributed to the system performance. These packaging technologies are based upon the basic concept of Powery・Time Product Theory and Media Delay Factor. This paper introduces above basical theory and shows the packaging technologies which have been used for the NEC's super computers.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e74-c_8_2331/_p
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@ARTICLE{e74-c_8_2331,
author={Toshihiko WATARI, Akihiro DOHYA, },
journal={IEICE TRANSACTIONS on Electronics},
title={High Performance Packaging Technology for Supercomputers},
year={1991},
volume={E74-C},
number={8},
pages={2331-2336},
abstract={Sophisticated packging technology and up-to-date semiconductor technology are the key to increase system performance. The use of high density packaging technology such as polyimide-ceramic super substrate, ultra small outline chip carrier FTC (Flipped TAB Carrier) and higher thermal conductive LCM (Liquid Cooling Module) has mainly contributed to the system performance. These packaging technologies are based upon the basic concept of Powery・Time Product Theory and Media Delay Factor. This paper introduces above basical theory and shows the packaging technologies which have been used for the NEC's super computers.},
keywords={},
doi={},
ISSN={},
month={August},}
Copy
TY - JOUR
TI - High Performance Packaging Technology for Supercomputers
T2 - IEICE TRANSACTIONS on Electronics
SP - 2331
EP - 2336
AU - Toshihiko WATARI
AU - Akihiro DOHYA
PY - 1991
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E74-C
IS - 8
JA - IEICE TRANSACTIONS on Electronics
Y1 - August 1991
AB - Sophisticated packging technology and up-to-date semiconductor technology are the key to increase system performance. The use of high density packaging technology such as polyimide-ceramic super substrate, ultra small outline chip carrier FTC (Flipped TAB Carrier) and higher thermal conductive LCM (Liquid Cooling Module) has mainly contributed to the system performance. These packaging technologies are based upon the basic concept of Powery・Time Product Theory and Media Delay Factor. This paper introduces above basical theory and shows the packaging technologies which have been used for the NEC's super computers.
ER -
English
