Sophisticated packging technology and up-to-date semiconductor technology are the key to increase system performance. The use of high density packaging technology such as polyimide-ceramic super substrate, ultra small outline chip carrier FTC (Flipped TAB Carrier) and higher thermal conductive LCM (Liquid Cooling Module) has mainly contributed to the system performance. These packaging technologies are based upon the basic concept of PoweryTime Product Theory and Media Delay Factor. This paper introduces above basical theory and shows the packaging technologies which have been used for the NEC's super computers.