This paper describes the wafer-level, three-dimensional packaging for MEMS in which sensors, actuators, electronic circuits and other functions are combined together in one integrated block. Si wafers with built-in MEMS functions were integrated with no change in thickness to ensure mechanical strength and improve heat dissipation. In the entire process of three-dimensional integration, Si wafers were processed at temperatures below 400C to prevent degradation of their built-in functions. A description is made of the low-temperature oxidation technology developed by us, which makes through-holes of high density and high aspect ratio in Si wafers with built-in functions by the Optical Excitation Electropolishing Method (OEEM) and forms an oxide film on the hole walls simply by replacing electrolyte. Next, a description is presented of the bumpless interconnection method which fills through-holes of stacked layers with metal by the molten metal suction method and of the electrocapillary effect as a countermeasure to prevent the filler metal from dropping out of holes under its own weight.

Contact recording systems have been studied for future magnetic recording disks with a high recording density. Tribological key technologies for ultra-low spacing and high wear performance are required for the contact systems. Particularly, a liquid lubrication system plays an important roll for reducing a mechanical spacing and improving wear performances. However, a lubrication design concept for contact recording systems is not established. In this study, molecular design of lubricants for contact systems will be discussed from a viewpoint of bouncing and wear behaviors. As a result, a minimum bouncing height of 3 nm and a high wear performance were obtained for ion-etched contact sliders by the optimization of design parameters, i. e. pad design and lubricant material.