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Ki Chan EUN Young Chul LEE Byung Gun CHOI Dae Jun KIM Chul Soon PARK
Fully embedded spiral inductors in a low loss dielectric multi-layer were designed and fabricated using a low temperature co-fired ceramics (LTCC) technology for RF SIP (system in package) integrations. The line width/space and the number of spiral layers were optimized within five layers of LTCC dielectric for high Q-factor, high self-resonant frequency (SRF), process easiness, and compact size. The embedded multi-layer spiral inductors reveal better performance in terms of Q-factor, SRF and the effective inductance Leff than planar spiral inductors of the same dimension and number of turns. The optimized multi-layer spiral inductor shows maximum Q of 56, Leff of 6.6 nH at Qmax and SRF of 3.6 GHz while planar spiral inductors have maximum Q of 49, Leff of 5.8 nH at Qmax and SRF of 3.0 GHz.