IEICE TRANSACTIONS on Electronics
Fully Embedded Low Temperature Co-fired Ceramics (LTCC) Spiral Inductors for L-Band RF System-in-Package (SIP) Applications
Summary :
Fully embedded spiral inductors in a low loss dielectric multi-layer were designed and fabricated using a low temperature co-fired ceramics (LTCC) technology for RF SIP (system in package) integrations. The line width/space and the number of spiral layers were optimized within five layers of LTCC dielectric for high Q-factor, high self-resonant frequency (SRF), process easiness, and compact size. The embedded multi-layer spiral inductors reveal better performance in terms of Q-factor, SRF and the effective inductance Leff than planar spiral inductors of the same dimension and number of turns. The optimized multi-layer spiral inductor shows maximum Q of 56, Leff of 6.6 nH at Qmax and SRF of 3.6 GHz while planar spiral inductors have maximum Q of 49, Leff of 5.8 nH at Qmax and SRF of 3.0 GHz.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E86-C No.6 pp.1089-1092
- Publication Date
- 2003/06/01
- Publicized
- Online ISSN
- DOI
- Type of Manuscript
- Special Section LETTER (Special Issue on Devices and Circuits for Next Generation Multi-Media Communication Systems)
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Ki Chan EUN, Young Chul LEE, Byung Gun CHOI, Dae Jun KIM, Chul Soon PARK, "Fully Embedded Low Temperature Co-fired Ceramics (LTCC) Spiral Inductors for L-Band RF System-in-Package (SIP) Applications" in IEICE TRANSACTIONS on Electronics,
vol. E86-C, no. 6, pp. 1089-1092, June 2003, doi: .
Abstract: Fully embedded spiral inductors in a low loss dielectric multi-layer were designed and fabricated using a low temperature co-fired ceramics (LTCC) technology for RF SIP (system in package) integrations. The line width/space and the number of spiral layers were optimized within five layers of LTCC dielectric for high Q-factor, high self-resonant frequency (SRF), process easiness, and compact size. The embedded multi-layer spiral inductors reveal better performance in terms of Q-factor, SRF and the effective inductance Leff than planar spiral inductors of the same dimension and number of turns. The optimized multi-layer spiral inductor shows maximum Q of 56, Leff of 6.6 nH at Qmax and SRF of 3.6 GHz while planar spiral inductors have maximum Q of 49, Leff of 5.8 nH at Qmax and SRF of 3.0 GHz.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e86-c_6_1089/_p
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@ARTICLE{e86-c_6_1089,
author={Ki Chan EUN, Young Chul LEE, Byung Gun CHOI, Dae Jun KIM, Chul Soon PARK, },
journal={IEICE TRANSACTIONS on Electronics},
title={Fully Embedded Low Temperature Co-fired Ceramics (LTCC) Spiral Inductors for L-Band RF System-in-Package (SIP) Applications},
year={2003},
volume={E86-C},
number={6},
pages={1089-1092},
abstract={Fully embedded spiral inductors in a low loss dielectric multi-layer were designed and fabricated using a low temperature co-fired ceramics (LTCC) technology for RF SIP (system in package) integrations. The line width/space and the number of spiral layers were optimized within five layers of LTCC dielectric for high Q-factor, high self-resonant frequency (SRF), process easiness, and compact size. The embedded multi-layer spiral inductors reveal better performance in terms of Q-factor, SRF and the effective inductance Leff than planar spiral inductors of the same dimension and number of turns. The optimized multi-layer spiral inductor shows maximum Q of 56, Leff of 6.6 nH at Qmax and SRF of 3.6 GHz while planar spiral inductors have maximum Q of 49, Leff of 5.8 nH at Qmax and SRF of 3.0 GHz.},
keywords={},
doi={},
ISSN={},
month={June},}
Copy
TY - JOUR
TI - Fully Embedded Low Temperature Co-fired Ceramics (LTCC) Spiral Inductors for L-Band RF System-in-Package (SIP) Applications
T2 - IEICE TRANSACTIONS on Electronics
SP - 1089
EP - 1092
AU - Ki Chan EUN
AU - Young Chul LEE
AU - Byung Gun CHOI
AU - Dae Jun KIM
AU - Chul Soon PARK
PY - 2003
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E86-C
IS - 6
JA - IEICE TRANSACTIONS on Electronics
Y1 - June 2003
AB - Fully embedded spiral inductors in a low loss dielectric multi-layer were designed and fabricated using a low temperature co-fired ceramics (LTCC) technology for RF SIP (system in package) integrations. The line width/space and the number of spiral layers were optimized within five layers of LTCC dielectric for high Q-factor, high self-resonant frequency (SRF), process easiness, and compact size. The embedded multi-layer spiral inductors reveal better performance in terms of Q-factor, SRF and the effective inductance Leff than planar spiral inductors of the same dimension and number of turns. The optimized multi-layer spiral inductor shows maximum Q of 56, Leff of 6.6 nH at Qmax and SRF of 3.6 GHz while planar spiral inductors have maximum Q of 49, Leff of 5.8 nH at Qmax and SRF of 3.0 GHz.
ER -
English
