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A-Ram CHOI Sang-Sik CHOI Byung-Guan PARK Dongwoo SUH Gyungock KIM Jin-Tae KIM Jin-Soo CHOI Deok-Ho CHO Tae-Hyun HAN Kyu-Hwan SHIM
This paper presents the selective epitaxial growth (SEG) properties of reduced pressure chemical vapor deposition (RPCVD) at low temperatures (LT) of 675-725 with high aspect ratio mask of dielectric films. The SEG process could be explained in conjunction with the loading effect, the mask pattern shape/size, and the process parameters of RPCVD. The growth rates showed a large non-uniformity up to 40% depending upon the pattern size of the dielectric mask films, but as the SEG film becomes thicker, the growth rate difference converged on 15% between the narrow 2-µm and the wide 100-µm patterns. The evolution of SEG was controlled dominantly by the surface migration control at the initial stage, and converted to the surface topology control. The design of pattern size and distribution with dummy patterns must be useful to accomplish the reliable and uniform LT-SEG.