This paper describes the innovation in single chip package design for mainframe computers coupled with major advances in "Controlled Collapse Chip Connection (C4)" technology, multilayer ceramic technology, and thin-film technology. C4 technology allows the LSI chips to be connected with high integration and high-performance. Applying C4 technology to chip-to-package and package-to-module interconnections provides a higher level of connection pads out from a small package. A new material 96.5 Sn/3.5 Ag for solder joints has been developed to facilitate reliable interconnection where thermal fatigue might have been a problem. The microstructure of a fractured surface and the estimation based on "Finite Element Method (FEM)" are correlated. New material and a process of mullite-glass has been developed to attain a thermal expansion coefficient close to that of silicon. The metallized ceramic technology for the mullite-glass can be applied to the substrate of LSI packages as well as multilayer ceramic multi-chip modules. Thin-film technology has been studied to form high-density wiring on package substrates. Using photolithography technique, it is possible to pattern pads accurately enough for connection to an LSI chip. The polyimide-Al combination can be patterned by subtractive technique using liquid etchants and sputtering. The via formation process is simplified using a photosensitive polyimide so that the fabrication process for multilayer wiring becomes suitable for mass production. Hitachi recently announced the HITAC M-880 Processor Unit which makes extensive use of these technologies. The general features of the LSI package "Micro Carrier for LSI Chip (MCC)" is also outlined.

This paper first proposes an object-oriented service network model, which is composed of application, server and resource object groups, from both viewpoints of rapid and smooth introduction and effective execution of the next generation IN services. The paper also, proposes a testbed system, which is referred to as "To-be-IN (Testbed on Object-oriented and B-ISDN Environment for IN)", for evaluating network architecture based on the proposed model. Using the testbed, several technical issues can be solved such as object-oriented realization of IN services, a provision of distribution transparent environment and a transition strategy from today's IN network. The testbed system is constructed on a currently available computing environment in which a distribution transparency mechanism is added. This system provides Service Creation Environment (SCE) for a purpose of achieving seamless software transfer from a development phase to an operation phase in the object-oriented service network model. The paper finally summarizes some results of an experimental implementation of the system.