The temperature compensation technique of InGaP/GaAs power heterojunction bipolar transistor (HBT) with novel bias circuit using Schottky diodes has been developed. The variation in the quiescent current to the temperature is less than 30% from -30C to 90C by this technique, where that is about 125% by the conventional bias circuit. The RF performance of the power HBT MMIC with novel bias circuit shows flat temperature characteristics enough to be used for power application of wireless communications.

InGaP/GaAs HBT with novel ledge coupled capacitor (LCC) structure has been proposed and demonstrated for the first time. The LCC employs an extrinsic InGaP ledge layer as a capacitor parallel to the base resistor. This configuration enables feeding RF signals directly into the base without passing them through the base resistor. With the fabricated HBT, no increase of leakage current between emitter and base electrode was observed. The maximum oscillation frequency (fmax) of the HBT was improved by 10 GHz as compared with an HBT without the LCC.