We have studied effects of additive elements into the channel layers of amorphous IGZO TFTs on threshold voltage shift issues under light illumination stress condition. By addition of Hf or Si element, the Vth shift under light illumination and negative bias-temperature stress and illumination stress conditions was drastically suppressed while the switching operation of TFTs using IGZO with Mn or Cu was not observed. It was found that the addition of Si or Hf element into the IGZO channel layer leads to reducing the hole trap sites formed at or near the gate insulator/IGZO channel interface.

Microwave photoconductivity decay (µ-PCD) method was applied to evaluate the effects of chemical composition and Ar+ plasma induced damage on the bulk and the surface states in amorphous In-Ga-Zn-O (a-IGZO) films. It was found that the peak reflectivity signal in the photoconductivity response increased with decreasing the Ga content, and had a strong correlation with the a-IGZO transistor performances. In addition, the peak reflectivity signals obtained after various Ar+ plasma treatment duration were well correlated with the transistor characteristics. With Ar+ plasma treatment, the peak reflectivity signal decreased in accordance with degradation of transistor characteristics. The µ-PCD method was found to be a very useful tool not only to evaluate the bulk and the surface states, but also to predict the performance of a-IGZO transistors subjected to various plasma processes in the production.