Directional dry etching of Tantalum is described X-ray lithography absorber patterns. Experiments are carried out using both reactive ion etching in CBrF3-based plasma and electron-cyclotron-resonance ion-stream etching in Cl2-based plasma. Ta absorber patterns with perpendicular sidewalls cannot be obtained by RIE when only CBrF3 gas is used as the etchant. While adding CH4 to CBrF3 effectively improves the undercutting of Ta patterns, it deteriorates etching stability because of the intensive deposition effect of CH4 fractions. By adding an Ar/CH4 mixture gas to CBrF3, it is possible to use RIE to fabricate 0.2-µm Ta absorber patterns with perpendicular sidewalls. ECR ion-stream etching is investigated to obtain high etching selectivity between Ta and SiO2 (etching mask)/SiN (membrane). Adding O2 to the Cl2 etchant improves undercutting without remarkably decreasing etching selectivity. Furthermore, an ECR ion-stream etching method is developed to stably etch Ta absorber patterns finer than 0.2µm. This is successfully applied to X-ray lithography mask fabrication for LSI test devices.

A 0.25-µm BiCMOS technology has been developed using three sophisticated technologies; the HSST/BiCMOS device, synchrotron orbital radiation (SOR) X-ray lithography, and an advanced two-level metallization. The HSST/BiCMOS provides a 25.4-ps double-poly bipolar device using High-performance Super Self-Aligned Process Technology (HSST), and a 42 ps/2 V CMOS inverter. SOR lithography allows a 0.18 µm gate and 0.2 µm via-hole patternings by using single-level resists. The metallization process features a new planarization technique of the 0.3-µm first wire, and a selective CVD aluminum plug for a 0.25 µm via-hole with contact resistance lower than 1Ω. These 0.25-µm technologies are used to successfully fabricate a 4 KG 0.25 µm CMOS gate-array LSI on a BiCMOS test chip of 12 mm square, which operates at 58 ps/G at 2 V. This result demonstrates that SOR lithography will pave the way for the fabrication of sub-0.25-µm BiCMOS ULSIs.

Field assembly of optical connectors is demanded because of the wide use of optical fiber in telecommunications systems. We propose a new assembling techniques that enable us to assemble connectors anywhere quickly and cost effectively. The key points are an adhesive technique and a polishing technique. In this report, we focus mainly on our a new polishing machine, which is suitable for optical connector ends machining on-site. The machine which is small and light weight can finish optical connector ends easily in a short time with enough low cost.

We have developed an optical connector assembly method that allows the rapid on-site installation of an optical connector. To simplify this on-site assembly process we fabricated built-in parts that enable us to install the optical connector using pre-assembled optical connector parts. Moreover, we have established an advanced method for applying a solidifying agent that adheres to the inner wall of a ferrule flange. With our assembly method, we can complete on-site optical connector installation, other than the polishing process, in two steps, namely bonding agent application and fiber insertion.