Tantalum Dry-Etching Characteristics for X-Ray Mask Fabrication
Summary :
Directional dry etching of Tantalum is described X-ray lithography absorber patterns. Experiments are carried out using both reactive ion etching in CBrF3-based plasma and electron-cyclotron-resonance ion-stream etching in Cl2-based plasma. Ta absorber patterns with perpendicular sidewalls cannot be obtained by RIE when only CBrF3 gas is used as the etchant. While adding CH4 to CBrF3 effectively improves the undercutting of Ta patterns, it deteriorates etching stability because of the intensive deposition effect of CH4 fractions. By adding an Ar/CH4 mixture gas to CBrF3, it is possible to use RIE to fabricate 0.2-µm Ta absorber patterns with perpendicular sidewalls. ECR ion-stream etching is investigated to obtain high etching selectivity between Ta and SiO2 (etching mask)/SiN (membrane). Adding O2 to the Cl2 etchant improves undercutting without remarkably decreasing etching selectivity. Furthermore, an ECR ion-stream etching method is developed to stably etch Ta absorber patterns finer than 0.2µm. This is successfully applied to X-ray lithography mask fabrication for LSI test devices.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E77-C No.2 pp.255-262
- Publication Date
- 1994/02/25
- Publicized
- Online ISSN
- DOI
- Type of Manuscript
- PAPER
- Category
- Integrated Electronics
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Akira OZAWA, Shigehisa OHKI, Masatoshi ODA, Hideo YOSHIHARA, "Tantalum Dry-Etching Characteristics for X-Ray Mask Fabrication" in IEICE TRANSACTIONS on Electronics,
vol. E77-C, no. 2, pp. 255-262, February 1994, doi: .
Abstract: Directional dry etching of Tantalum is described X-ray lithography absorber patterns. Experiments are carried out using both reactive ion etching in CBrF3-based plasma and electron-cyclotron-resonance ion-stream etching in Cl2-based plasma. Ta absorber patterns with perpendicular sidewalls cannot be obtained by RIE when only CBrF3 gas is used as the etchant. While adding CH4 to CBrF3 effectively improves the undercutting of Ta patterns, it deteriorates etching stability because of the intensive deposition effect of CH4 fractions. By adding an Ar/CH4 mixture gas to CBrF3, it is possible to use RIE to fabricate 0.2-µm Ta absorber patterns with perpendicular sidewalls. ECR ion-stream etching is investigated to obtain high etching selectivity between Ta and SiO2 (etching mask)/SiN (membrane). Adding O2 to the Cl2 etchant improves undercutting without remarkably decreasing etching selectivity. Furthermore, an ECR ion-stream etching method is developed to stably etch Ta absorber patterns finer than 0.2µm. This is successfully applied to X-ray lithography mask fabrication for LSI test devices.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e77-c_2_255/_p
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@ARTICLE{e77-c_2_255,
author={Akira OZAWA, Shigehisa OHKI, Masatoshi ODA, Hideo YOSHIHARA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Tantalum Dry-Etching Characteristics for X-Ray Mask Fabrication},
year={1994},
volume={E77-C},
number={2},
pages={255-262},
abstract={Directional dry etching of Tantalum is described X-ray lithography absorber patterns. Experiments are carried out using both reactive ion etching in CBrF3-based plasma and electron-cyclotron-resonance ion-stream etching in Cl2-based plasma. Ta absorber patterns with perpendicular sidewalls cannot be obtained by RIE when only CBrF3 gas is used as the etchant. While adding CH4 to CBrF3 effectively improves the undercutting of Ta patterns, it deteriorates etching stability because of the intensive deposition effect of CH4 fractions. By adding an Ar/CH4 mixture gas to CBrF3, it is possible to use RIE to fabricate 0.2-µm Ta absorber patterns with perpendicular sidewalls. ECR ion-stream etching is investigated to obtain high etching selectivity between Ta and SiO2 (etching mask)/SiN (membrane). Adding O2 to the Cl2 etchant improves undercutting without remarkably decreasing etching selectivity. Furthermore, an ECR ion-stream etching method is developed to stably etch Ta absorber patterns finer than 0.2µm. This is successfully applied to X-ray lithography mask fabrication for LSI test devices.},
keywords={},
doi={},
ISSN={},
month={February},}
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TY - JOUR
TI - Tantalum Dry-Etching Characteristics for X-Ray Mask Fabrication
T2 - IEICE TRANSACTIONS on Electronics
SP - 255
EP - 262
AU - Akira OZAWA
AU - Shigehisa OHKI
AU - Masatoshi ODA
AU - Hideo YOSHIHARA
PY - 1994
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E77-C
IS - 2
JA - IEICE TRANSACTIONS on Electronics
Y1 - February 1994
AB - Directional dry etching of Tantalum is described X-ray lithography absorber patterns. Experiments are carried out using both reactive ion etching in CBrF3-based plasma and electron-cyclotron-resonance ion-stream etching in Cl2-based plasma. Ta absorber patterns with perpendicular sidewalls cannot be obtained by RIE when only CBrF3 gas is used as the etchant. While adding CH4 to CBrF3 effectively improves the undercutting of Ta patterns, it deteriorates etching stability because of the intensive deposition effect of CH4 fractions. By adding an Ar/CH4 mixture gas to CBrF3, it is possible to use RIE to fabricate 0.2-µm Ta absorber patterns with perpendicular sidewalls. ECR ion-stream etching is investigated to obtain high etching selectivity between Ta and SiO2 (etching mask)/SiN (membrane). Adding O2 to the Cl2 etchant improves undercutting without remarkably decreasing etching selectivity. Furthermore, an ECR ion-stream etching method is developed to stably etch Ta absorber patterns finer than 0.2µm. This is successfully applied to X-ray lithography mask fabrication for LSI test devices.
ER -
English
