The high-speed and low-power system LSIs in recent years have crucial need for managing power supply noise so that it might not substantially affect the circuit functionality and performance. The decoupling capacitance is known as an effective measure for suppressing the power supply noise. In this paper, we propose a design methodology for decoupling capacitance budgeting, in which the decoupling capacitance is distributed appropriately over the LSI chip area in order to suppress the power supply noise of each local region. For efficient budgeting, we introduced a new concept of power-capacitance ratio, which is the ratio of power dissipation to capacitance. The proposed method first performs a simplified power supply noise analysis by using a lumped circuit model to determine the total required on-chip capacitance, and calculate the power-capacitance ratio. Then, in the layout design phase, the decoupling capacitance budgeting is performed by using the above power-capacitance ratio as a guideline. The effectiveness of the proposed method was verified by using SPICE simulations on example chip models of 90 nm technology node. The verification results show that, even for a chip with very wide on-chip variation in power density, the proposed method can suppress the power supply noise of each local region effectively.

As the LSI process technology advances and the gate size becomes smaller, the signal delay on interconnect becomes a significant factor in the signal path delay. Also, as the size of interconnect structure becomes smaller, the interconnect process variations have become one of the dominant factors which influence the signal delay and thus clock skew. Therefore, controlling the influence of interconnect process variations on clock skew is a crucial issue in the advanced process technologies. In this paper, we propose a method for minimizing clock skew fluctuations caused by interconnect process variations. The proposed method identifies the suitable balance of clock buffer size and wire length in order to minimize the clock skew fluctuations caused by the interconnect process variations. Experimental results on test circuits of 28nm process technology show that the proposed method reduces the clock skew fluctuations by 30-92% compared to the conventional method.

This paper presents an algorithm for the scan-chain optimization problem in multiple-scan design methodology. The proposed algorithm, which consists of four phases, first determines pairs of scan-in and scan-out pins (Phase 1), and then assigns flip-flops to scan-paths by using a graph theoretical method (Phase 2). Next the algorithm decides connection-order of flip-flops in each scan-path by using TSP (Traveling Salesman Problem) heuristics (Phase 3), and finally exchanges flip-flops among scan-paths in order to reduce total scan-path length (Phase 4). Experiments using actual design data show that, for ten scan-paths, our algorithm achieved a 90% reduction in scan-test time at the expense of a 7% total scan-path length increase as compared with the length of a single optimized scan-path. Also, our algorithm produced less total scan-path length than other three possible algorithms in a reasonable computing time.