First we introduce the high-frequency equivalent circuit model of the Fine Pitched Ball Grid Array (FPBGA) bonding for frequencies up to 20 GHz. The lumped circuit model of the FPBGA bonding was extracted based on S-parameters measurement and subsequent fitting of the model parameters. The test packages, which contain probing pads, coplanar waveguides and FPBGA ball bonding, were fabricated and measured. The suggested π-model of the FPBGA bonding consists of self-inductor, self-capacitor, and self-resistor components. From the extracted model, a solder ball of 350 µm diameter and 800 µm ball pitch has less than 0.08 nH self-inductance, 0.40 pF self capacitance, and about 10 mΩ self-resistance. In addition, the mutual capacitance caused by the presence of the adjacent bonding balls is included in the model. The FPBGA solder ball bonding has less than 1.5 dB insertion loss up to 20 GHz, and it causes negligible delay time in digital signal transmission. The extracted circuit model of FPBGA bonding is useful in design and performance simulation of advanced packages, which use FPBGA bonding.