In this paper, we present and verify a new chip-package co-modeling and simulation approach for a low-noise chip-package hierarchical power distribution network (PDN) design. It is based on a hierarchical modeling to combine distributed circuit models at both chip-level PDN and package-level PDN. In particular, it includes all on- and off-chip parasitic circuit elements in the hierarchical PDN with a special consideration on on-chip decoupling capacitor design and placement inside chip. The proposed hierarchical PDN model was successfully validated with good correlations and subsequent analysis to a series of Z11 and Z21 PDN impedance measurements with a frequency range from 1 MHz to 3 GHz. Using the proposed model, we can analyze and estimate the performance of the chip-package hierarchical PDN as well as can predict the effect of high frequency electromagnetic interactions between the chip-level PDN and the package-level PDN. Furthermore, we can precisely anticipate PDN resonance frequencies, noise generation sources, and noise propagation paths through the multiple levels in the hierarchical PDN.

We present the concept of an on-line electric vehicle (OLEV) and its wireless power transfer mechanism and analyze the electromagnetic compatibility characteristics. As magnetic fields transfer 100kW of power to the vehicle, reduction of electromagnetic field (EMF) noise is a critical issue for protection of the human body. Also, with respect to electromagnetic interference (EMI) noise, a proper measurement method has not yet been established for this low frequency high power system. In this paper, low frequency magnetic field shielding methods and application of the shields to the OLEV system are presented. Furthermore, a standard low frequency magnetic field measurement is suggested as an EMI test.

We have thoroughly investigated the effect of on-chip decoupling capacitors on the simultaneous switching noise (SSN) and the radiated emission. Furthermore, we have successfully demonstrated an efficient design method for on-chip decoupling capacitors on an 8-bit microcontroller without increasing the die size, which results in more than 10 dB of suppressed radiated emission.

The effect of the power/ground plane on the through-hole signal via is analyzed in a viewpoint of a band-stop filter. When the through-hole signal via passes through the power/ground plane, the return current path discontinuity of the through-hole signal via occurs due to the high impedance of the power/ground plane. Since the high impedance is produced by the power/ground plane resonance, it acts as a band-stop filter, which is connected to the signal trace in series. Therefore, the power/ground plane filters off its resonance frequency component by absorbing and reflecting from the signal on the through-hole signal via, and consequently the signal distortion, the power/ground plane noise voltage, and the consequent radiated emission occur. With S-parameter and TDR-TDT measurements, the band-stop effect of the power/ground plane on the through-hole signal via is confirmed. And then, this analysis is applied to the clock transmission through the through-hole signal via to obtain the clearer confirmation. The measurements of the distorted clock waveforms, the induced power/ground plane noise voltages, and the radiated emissions depending on the power/ground plane impedance around the through-hole signal via are shown.

Analytical solutions for the frequency-dependent transmission line model parameters of a stranded coaxial cable, which are not trivial due to the complex geometry, are presented and discussed in this paper. A frequency-dependent effective conductor radius of a stranded wire coaxial cable is proposed to estimate the internal impedance using the Bessel function solutions of a solid wire coaxial cable. The performance of the proposed model is verified by electromagnetic field solver simulation and by experimental measurement. The results show that the proposed model successfully calculates the broadband frequency-dependent RLGC model parameters and characteristic impedance of a stranded wire coaxial cable with high accuracy.

First we introduce the high-frequency equivalent circuit model of the Fine Pitched Ball Grid Array (FPBGA) bonding for frequencies up to 20 GHz. The lumped circuit model of the FPBGA bonding was extracted based on S-parameters measurement and subsequent fitting of the model parameters. The test packages, which contain probing pads, coplanar waveguides and FPBGA ball bonding, were fabricated and measured. The suggested π-model of the FPBGA bonding consists of self-inductor, self-capacitor, and self-resistor components. From the extracted model, a solder ball of 350 µm diameter and 800 µm ball pitch has less than 0.08 nH self-inductance, 0.40 pF self capacitance, and about 10 mΩ self-resistance. In addition, the mutual capacitance caused by the presence of the adjacent bonding balls is included in the model. The FPBGA solder ball bonding has less than 1.5 dB insertion loss up to 20 GHz, and it causes negligible delay time in digital signal transmission. The extracted circuit model of FPBGA bonding is useful in design and performance simulation of advanced packages, which use FPBGA bonding.

We propose an accurate and efficient model of having an unbalanced differential line structure, where mode-conversion and frequency dependent loss effects are considered in above the GHz frequency range. To extract model parameters of the proposed unbalanced differential line model, we measured s-parameters of test patterns using a 2-port VNA and defined a new type of mixed-mode s-parameter. The model parameters were obtained and are described for various types of the unbalanced differential line structures. Finally, the validity of the proposed model and the model parameters were successfully confirmed by a series of time-domain measurements and a lattice diagram analysis.