We have developed 0.5-µm-emitter InP-based HBTs with high reliability. The HBTs incorporate a passivation ledge structure and tungsten-based emitter metal. A fabricated HBT exhibits high collector current density and a current gain of 58 at a collector current density of 4 mA/µm2. The results of dc measurements indicate that the ledge layer sufficiently suppresses the recombination current at the emitter-base periphery. The HBT also exhibits an ft of 321 GHz and an fmax of 301 GHz at a collector current density of 4 mA/µm2. The ft does not degrade even though the emitter size is reduced to as small as 0.5 µm2 µm. The results of an accelerated life test show that the degradation of dc current gain is due to thermal degradation of the interfacial quality of semiconductors at the passivation ledge. The activation energy is expected to be around 1.5 eV, and the extrapolated mean time to failure is expected to be over 108 hours at a junction temperature of 125. These results indicate that this InP HBT technology is promising for making over-100-Gbit/s ICs with high reliability.

This paper investigates the effects of n-type doping in the emitter-base heterojunction vicinity on the DC and high-frequency characteristics of InP/InGaAs heterojunction bipolar transistors (HBTs). The n-type doping is shown to be very effective for enhancing the tunneling-injection current from the emitter and thus for reducing the collector-current turn-on voltage. However, it is also revealed that an unnecessary increase in the doping level only degrades the current gain, especially in the low-current region. A higher doping level also increases the emitter junction capacitance. The optimized HBT structures with a 0.5-µm-wide emitter exhibit turn-on voltage as low as 0.78 V and current gain of around 80 at JC = 1 mA/µm2. They also provide a current-gain cutoff frequency, ft, of 280 GHz and a maximum oscillation frequency, fmax, of 385 GHz at VCE = 1 V and JC = 3 mA/µm2. These results indicate that the proposed HBTs are very useful for high-speed and low-power IC applications.

We demonstrated the uniformity and stability as well as the high breakdown voltage of 0.1-µm-gate InP HEMTs with a double recess structure. To overcome the drawbacks regarding the uniformity and stability in the double recess structure, an InP passivation layer that functions as an etch-stopper and a surface passivator was successfully applied to the structure. It was confirmed that there was no degradation in the uniformity and stability of device performance for the double recess HEMTs that had the breakdown voltages in the on-state and off-state improved by a factor of 1.6.