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[Author] Yoshitsugu YAMAMOTO(2hit)

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  • Analysis of a Phase Factor of Franz-Keldysh Oscillations in GaAs/AlGaAs Heterostructures

    Hideo TAKEUCHI  Yoshitsugu YAMAMOTO  Ryo HATTORI  Takahide ISHIKAWA  Masaaki NAKAYAMA  

     
    PAPER

      Vol:
    E86-C No:10
      Page(s):
    2015-2021

    We propose an analysis method for Franz-Keldysh (FK) oscillations appearing in photoreflectance (PR) spectra of heterojunction device structures, which enables precise and simultaneous evaluation of the built-in electric field strength and band-gap energy. Samples for PR measurements were n+-GaAs/n-Al0.3 Ga0.7 As/i-GaAs heterostructures with different Al0.3Ga0.7As-layer thickness. We have found that the phase of the FK oscillations originating from the i-GaAs buffer layer depends on the Al0.3 Ga0.7 As-layer thickness. We have derived a calculation model for FK oscillations that includes the interference of probe light. From the comparison of the calculated spectra with the measured spectra, we conclude that mixing of the real and imaginary parts of a modulated dielectric function, which is caused by the probe-light interference, gives rise to the phase shift of the FK oscillations. Our FK-oscillation analysis method reduces ambiguity in the estimation of band-gap energy that is considerable in a conventional analysis.

  • A Super Low Noise AlInAs/InGaAs HEMT Fabricated by Selective Gate Recess Etching

    Naohito YOSHIDA  Toshiaki KITANO  Yoshitsugu YAMAMOTO  Takayuki KATOH  Hiroyuki MINAMI  Takuo KASHIWA  Takuji SONODA  Hirozo TAKANO  Osamu ISHIHARA  

     
    PAPER-Semiconductor Materials and Devices

      Vol:
    E78-C No:9
      Page(s):
    1279-1285

    A 0.15 µm T-shaped gate AlInAs/InGaAs high electron mobility transistor (HEMT) with an excellent RF performance has been developed using selective wet gate recess etching. The gate recess is formed by a pH-adjusted citric acid/NH4OH/H2O2 mixture with an etching selectivity of more than 30 for InGaAs over AlInAs. The standard deviation of saturation drain current (Idss) is as small as 3.2 mA for an average Idss of 47 mA on a 3 inch diameter InP wafer. The etching time for recess formation is optimized and an ft of 130 GHz and an MSG of 10 dB at 60 GHz are obtained. The extremely low minimum noise figure (Fmin) of 0.9 dB with an associated gain (Ga) of 7.0 dB has been achieved at 60 GHz for a SiON-passivated device. This noise performance is comparable to the lowest value of Fmin ever reported for an AlInAs/InGaAs HEMT with a passivation film.