This paper newly estimates the yield suppression for 1.5 V-1 Gbit DRAM caused by threshold voltage variation of MOSFET due to microscopic fluctuations in dopant distributions within the channel region and points out the limitation of the conventional redundancy techniques. The yield suppression is estimated for four main circuit blocks, the memory cell transfer transistor, bit line sense amplifier S/A, I/O line differential amplifier D/A, and the peripheral circuit. It is newly found that for 1.5 V-1 Gbit DRAM due to the effect of the newly estimated threshold voltage variation of MOSFET the bit failures of memory cells become the most dominant failure mode and the failure of D/A which can be ignored for 64 Mbit DRAM level can no longer be neglected. Furthermore, the novel optimized redundancy technique for replacing these failure is described.

Material research on capacitor dielectrics for DRAM applications is reviewed. The state of the art technologies to prepare Si3N4,Ta2O5, and SrTiO3 thin films for capacitors are described. The down-scaling limits for Si3N4 and Ta2O5 capacitors seem to be 3.5 and 1.5 nm SiO2 equivalent thickness, respectively. Combined with a rugged polysilicon electrode surface,Si3N4 and Ta2O5 based-capacitors are available for 256 Mbit and 1 Gbit DRAMs. At the present time, the minimum SiO2 equivalent thickness for high permittivity materials is around 1 nm with the leakage current density of 10-7 A/cm2. Among the great variety of ferroelectrics, two families of materials,i.e., Pb (Zr, Ti) O3 and (Ba, Sr) TiO3 have emerged as the most promising candidates for 1 Gbit DRAMs and beyond. If the chemical vapor deposition technology can be established for these materials, capacitor dielectrics should not be a limiting issue for Gbit DRAMs.