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Hiroshi SUGAWARA Toshio TAKESHIMA Hiroshi TAKADA Yoshiaki S. HISAMUNE Kohji KANAMORI Takeshi OKAZAWA Tatsunori MUROTANI Isao SASAKI
A 3.3 V single power-supply 64 Mb flash memory with a DBL programming scheme has been developed and fabricated with 0.4 µm CMOS technology. 50 ns access time and 256 b erase/programming unit-capacity have been achieved by using hierarchical word- and bit-line structures and DBL programming scheme. Furthermore in order to lower operating voltage the HiCR cell is used. The chip size is 19.3 mm13.3 mm.
Ken-ichi OYAMA Noriaki KODAMA Hiroki SHIRAI Kenji SAITOH Yosiaki S. HISAMUNE Takeshi OKAZAWA
A 0.4 µm stacked gate cell for a 64 Mbit flash memory has been developed which has the Symmetrical Side Wall Diffusion Self Aligned (SSW-DSA) structure. Using the proposed SSW-DSA cell with p+ pockets at both the drain and the source, and adequate punchthrough resistance to scale the gate length down to sub-half-micron has been obtained. It is also demonstrated that the channel erasing scheme applying negative bias to the gate, which is adopted for the SSW-DSA cell, shows lower trapped charges after Write/Erase (W/E) cycles evaluated by a charge pumping technique, and results in better endurance an retention characteristics than conventional erasing schemes.