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[Keyword] CMS(5hit)

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  • Problem Analyzing by Distributed, History and Trend Templates with Integrated Supporting of DCMS

    Zhiming CAI  Zhe YANG  Menghan WANG  

     
    LETTER-Software Engineering

      Vol:
    E97-D No:1
      Page(s):
    146-150

    In analysis of general-purpose problems which involves many factors from different viewpoints, an important challenge is to acquire different opinions and distributed modeling templates from multiple remote experts, and to aggregate these templates. In order to deal with this problem, we developed the Distributed Cooperative Modeling System (DCMS) by integrating our achievements [1]-[5]. The paper introduces how to analyze a complex problem using DCMS, with distributed templates from multiple experts, historical templates based on statistical data, and trend templates deduced from historical data, with the example of analyzing “diversification of Macao industries”

  • A Noise-Robust Continuous Speech Recognition System Using Block-Based Dynamic Range Adjustment

    Yiming SUN  Yoshikazu MIYANAGA  

     
    PAPER-Speech and Hearing

      Vol:
    E95-D No:3
      Page(s):
    844-852

    A new approach to speech feature estimation under noise circumstances is proposed in this paper. It is used in noise-robust continuous speech recognition (CSR). As the noise robust techniques in isolated word speech recognition, the running spectrum analysis (RSA), the running spectrum filtering (RSF) and the dynamic range adjustment (DRA) methods have been developed. Among them, only RSA has been applied to a CSR system. This paper proposes an extended DRA for a noise-robust CSR system. In the stage of speech recognition, a continuous speech waveform is automatically assigned to a block defined by a short time length. The extended DRA is applied to these estimated blocks. The average recognition rate of the proposed method has been improved under several different noise conditions. As a result, the recognition rates are improved up to 15% in various noises with 10 dB SNR.

  • Parametric Design for Resin Self-Alignment Capability

    Jong-Min KIM  Kozo FUJIMOTO  

     
    PAPER-Electronic Components

      Vol:
    E86-C No:10
      Page(s):
    2129-2136

    We have developed a novel self-alignment process using the surface tension of the liquid resin for assembly of electronic and optoelectronic devices. Due to their characteristics of low surface tension, however, the parametric design guidelines are necessary for resin self-alignment capability. In this paper, a shape prediction mathematical model and a numerical method are developed. The developed system is capable of achieving the liquid joint geometry and the parametric design for self-alignment capability. The influences of geometric parameters such as liquid volume, component weight, pad radius, liquid surface tension on the shape of liquid joint are investigated. Furthermore, the parametric design guidelines considered the process-related practical matters of misalignment level, distribution of the supplied liquid volumes and coplanarity deviation includes difference of the height between the pads are provided.

  • 3-D Highly Precise Self-Alignment Process Using Surface Tension of Liquid Resin Material

    Jong-Min KIM  Kiyokazu YASUDA  Young-Eui SHIN  Kozo FUJIMOTO  

     
    PAPER-Integrated Electronics

      Vol:
    E85-C No:7
      Page(s):
    1491-1498

    A novel self-alignment process using the surface tension of the liquid resin for assembly of electronic or optoelectronic devices in 3-D space has been proposed. The vertical alignment can be controlled by using of metal sphere, reducing the necessary precise process control such as solder volumes and external forces, and allowing large tolerances in liquid volume and misalignment. Lateral alignment could be also achieved by making the liquid resin constrained on the 3-dimensional pads on chip and substrate. This study focused on the principle of self-alignment and final alignment accuracy. In addition, the possibility of self-alignment process was verified by analytic numerical method and scaled-up experiment. An average alignment accuracy of less than 0.25 µm has been obtained. It is thought that this process is effective for assembly simply at low process temperature, low cost and without flux in future assembly techniques.

  • Self-Alignment Process Using Liquid Resin for Assembly of Electronic or Optoelectronic Devices

    Kozo FUJIMOTO  Jong-Min KIM  Shuji NAKATA  

     
    PAPER-Optoelectronics

      Vol:
    E84-C No:12
      Page(s):
    1967-1974

    We have developed a novel self-alignment process using the surface tension of the liquid resin for assembly of electronic or optoelectronic devices. Though the liquid resins have a characteristics as low as one tenth of the surface tension of solder in general, restoring forces for self-alignment capability can be produced by making it constrained on the 3-dimensional pads on chip and substrate. In this paper, its principle and characteristics are described and the relationship between process parameters and joint geometry were examined. And the possibility of self-alignment process was verified by analytic numerical method and scaled-up experiment. A self-alignment accuracy was examined experimentally and show that it became less than 0.4 µm. It can provide a useful information on various parameters involved in joint geometry and optimal design guideline to generate the proper profiles.