Temperature-tracking is becoming of paramount importance in modern electronic design automation tools. In this paper, we present a deterministic thermal placement algorithm for standard cell based layout which can lead to a smooth temperature distribution over the die. It is mainly based on Fiduccia-Mattheyses partition scheme and a former substrate thermal model that can convert the known temperature constraints into the corresponding power distribution constraints. Moreover, a kind of force-directed heuristic based on cells' power consumption is introduced in the above process. Experimental results demonstrate a comparatively uniform temperature distribution and show a reduction of the maximal temperature on the die.

Incremental modification and optimization in VLSI physical design is of fundamental importance. Based on the O-tree (ordered tree) representation which has more prominent advantages in comparison with other topological representations of non-slicing floorplans, in this paper, we present an incremental placement algorithm for BBL (Building Block Layout) design in VLSI physical design. The good performance of experimental results in dealing with some instances proves the effectiveness of our algorithm.