Thermal-Aware Placement Based on FM Partition Scheme and Force-Directed Heuristic

Jing LI; Hiroshi MIYASHITA

doi:10.1093/ietfec/e89-a.4.989

Thermal-Aware Placement Based on FM Partition Scheme and Force-Directed Heuristic

Jing LI, Hiroshi MIYASHITA

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Temperature-tracking is becoming of paramount importance in modern electronic design automation tools. In this paper, we present a deterministic thermal placement algorithm for standard cell based layout which can lead to a smooth temperature distribution over the die. It is mainly based on Fiduccia-Mattheyses partition scheme and a former substrate thermal model that can convert the known temperature constraints into the corresponding power distribution constraints. Moreover, a kind of force-directed heuristic based on cells' power consumption is introduced in the above process. Experimental results demonstrate a comparatively uniform temperature distribution and show a reduction of the maximal temperature on the die.

Publication: IEICE TRANSACTIONS on Fundamentals Vol.E89-A No.4 pp.989-995

Publication Date: 2006/04/01

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Online ISSN: 1745-1337

DOI: 10.1093/ietfec/e89-a.4.989

Type of Manuscript: Special Section PAPER (Special Section on Selected Papers from the 18th Workshop on Circuits and Systems in Karuizawa)

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Jing LI, Hiroshi MIYASHITA, "Thermal-Aware Placement Based on FM Partition Scheme and Force-Directed Heuristic" in IEICE TRANSACTIONS on Fundamentals, vol. E89-A, no. 4, pp. 989-995, April 2006, doi: 10.1093/ietfec/e89-a.4.989.
Abstract: Temperature-tracking is becoming of paramount importance in modern electronic design automation tools. In this paper, we present a deterministic thermal placement algorithm for standard cell based layout which can lead to a smooth temperature distribution over the die. It is mainly based on Fiduccia-Mattheyses partition scheme and a former substrate thermal model that can convert the known temperature constraints into the corresponding power distribution constraints. Moreover, a kind of force-directed heuristic based on cells' power consumption is introduced in the above process. Experimental results demonstrate a comparatively uniform temperature distribution and show a reduction of the maximal temperature on the die.
URL: https://global.ieice.org/en_transactions/fundamentals/10.1093/ietfec/e89-a.4.989/_p

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@ARTICLE{e89-a_4_989,
author={Jing LI, Hiroshi MIYASHITA, },
journal={IEICE TRANSACTIONS on Fundamentals},
title={Thermal-Aware Placement Based on FM Partition Scheme and Force-Directed Heuristic},
year={2006},
volume={E89-A},
number={4},
pages={989-995},
abstract={Temperature-tracking is becoming of paramount importance in modern electronic design automation tools. In this paper, we present a deterministic thermal placement algorithm for standard cell based layout which can lead to a smooth temperature distribution over the die. It is mainly based on Fiduccia-Mattheyses partition scheme and a former substrate thermal model that can convert the known temperature constraints into the corresponding power distribution constraints. Moreover, a kind of force-directed heuristic based on cells' power consumption is introduced in the above process. Experimental results demonstrate a comparatively uniform temperature distribution and show a reduction of the maximal temperature on the die.},
keywords={},
doi={10.1093/ietfec/e89-a.4.989},
ISSN={1745-1337},
month={April},}

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TY - JOUR
TI - Thermal-Aware Placement Based on FM Partition Scheme and Force-Directed Heuristic
T2 - IEICE TRANSACTIONS on Fundamentals
SP - 989
EP - 995
AU - Jing LI
AU - Hiroshi MIYASHITA
PY - 2006
DO - 10.1093/ietfec/e89-a.4.989
JO - IEICE TRANSACTIONS on Fundamentals
SN - 1745-1337
VL - E89-A
IS - 4
JA - IEICE TRANSACTIONS on Fundamentals
Y1 - April 2006
AB - Temperature-tracking is becoming of paramount importance in modern electronic design automation tools. In this paper, we present a deterministic thermal placement algorithm for standard cell based layout which can lead to a smooth temperature distribution over the die. It is mainly based on Fiduccia-Mattheyses partition scheme and a former substrate thermal model that can convert the known temperature constraints into the corresponding power distribution constraints. Moreover, a kind of force-directed heuristic based on cells' power consumption is introduced in the above process. Experimental results demonstrate a comparatively uniform temperature distribution and show a reduction of the maximal temperature on the die.
ER -