In this paper, the author performed an electromagnetic field simulation of a typical bonding wire structure that connects a chip and a package, and evaluated the signal transmission characteristics (S-parameters). In addition, the inductance per unit length was extracted by comparing with the equivalent circuit of the distributed constant line. It turns out that the distributed constant line model is not sufficient because there are frequencies where chip-package resonance occurs. Below the resonance frequency, the conventional low-frequency approximation model was effective, and it was found that the inductance was about 1nH/mm.