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In this paper, the author performed an electromagnetic field simulation of a typical bonding wire structure that connects a chip and a package, and evaluated the signal transmission characteristics (S-parameters). In addition, the inductance per unit length was extracted by comparing with the equivalent circuit of the distributed constant line. It turns out that the distributed constant line model is not sufficient because there are frequencies where chip-package resonance occurs. Below the resonance frequency, the conventional low-frequency approximation model was effective, and it was found that the inductance was about 1nH/mm.
Takuichi HIRANO
Tokyo City University
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Takuichi HIRANO, "Evaluation and Extraction of Equivalent Circuit Parameters for GSG-Type Bonding Wires Using Electromagnetic Simulator" in IEICE TRANSACTIONS on Electronics,
vol. E105-C, no. 11, pp. 692-695, November 2022, doi: 10.1587/transele.2021ESS0002.
Abstract: In this paper, the author performed an electromagnetic field simulation of a typical bonding wire structure that connects a chip and a package, and evaluated the signal transmission characteristics (S-parameters). In addition, the inductance per unit length was extracted by comparing with the equivalent circuit of the distributed constant line. It turns out that the distributed constant line model is not sufficient because there are frequencies where chip-package resonance occurs. Below the resonance frequency, the conventional low-frequency approximation model was effective, and it was found that the inductance was about 1nH/mm.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/transele.2021ESS0002/_p
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@ARTICLE{e105-c_11_692,
author={Takuichi HIRANO, },
journal={IEICE TRANSACTIONS on Electronics},
title={Evaluation and Extraction of Equivalent Circuit Parameters for GSG-Type Bonding Wires Using Electromagnetic Simulator},
year={2022},
volume={E105-C},
number={11},
pages={692-695},
abstract={In this paper, the author performed an electromagnetic field simulation of a typical bonding wire structure that connects a chip and a package, and evaluated the signal transmission characteristics (S-parameters). In addition, the inductance per unit length was extracted by comparing with the equivalent circuit of the distributed constant line. It turns out that the distributed constant line model is not sufficient because there are frequencies where chip-package resonance occurs. Below the resonance frequency, the conventional low-frequency approximation model was effective, and it was found that the inductance was about 1nH/mm.},
keywords={},
doi={10.1587/transele.2021ESS0002},
ISSN={1745-1353},
month={November},}
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TY - JOUR
TI - Evaluation and Extraction of Equivalent Circuit Parameters for GSG-Type Bonding Wires Using Electromagnetic Simulator
T2 - IEICE TRANSACTIONS on Electronics
SP - 692
EP - 695
AU - Takuichi HIRANO
PY - 2022
DO - 10.1587/transele.2021ESS0002
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E105-C
IS - 11
JA - IEICE TRANSACTIONS on Electronics
Y1 - November 2022
AB - In this paper, the author performed an electromagnetic field simulation of a typical bonding wire structure that connects a chip and a package, and evaluated the signal transmission characteristics (S-parameters). In addition, the inductance per unit length was extracted by comparing with the equivalent circuit of the distributed constant line. It turns out that the distributed constant line model is not sufficient because there are frequencies where chip-package resonance occurs. Below the resonance frequency, the conventional low-frequency approximation model was effective, and it was found that the inductance was about 1nH/mm.
ER -