This paper describes a smart thermal sensing chip with an integrated vertical bipolar transistor sensor, a Sigma Delta Modulator (SDM), a Micro-Control Unit (MCU), and a bandgap reference voltage generator for biomedical application by using 0.18 µm CMOS process. The npn bipolar transistors with the Deep N-Well (DNW) instead of the pnp bipolar transistor is first adopted as the sensor for good isolation from substrate coupling noise. In addition to data compression, Micro-Control Unit (MCU) plays an important role for executing auto-calibration by digitally trimming the bipolar sensor in parallel to save power consumption and to reduce feedback complexity. It is different from the present analog feedback calibration technologies. Using one sensor, instead of two sensors, to create two differential signals in 180phase difference input to SDM is also a novel design of this work. As a result, in the range of 0 to 80 or body temperature (375), the inaccuracy is less than 0.1 or 0.05 respectively with one-point calibration after packaging. The average power consumption is 268.4 µW with 1.8 V supply voltage.

Substrate-coupling equivalent circuits can be derived for arbitrary isolation structures by F-matrix computation. The derived netlist represents a unified impedance network among multiple sites on a chip surface as well as internal nodes of isolation structures and can be applied with SPICE simulation to evaluate isolation strengths. Geometry dependency of isolation attributes to layout parameters such as area, width, and location distance. On the other hand, structural dependency arises from vertical impurity concentration specific to p+/n+ diffusion and deep n-well. Simulation-based prototyping of isolation structures can include all these dependences and strongly helps establish an isolation strategy against high-frequency substrate coupling in a given technology. The analysis of isolation strength provided by p+/n+ guard ring, deep n-well guard ring as well as deep n-well pocket well explains S21 measurements performed on high-frequency test structures targeting 5 GHz bandwidth, that was formed in a 0.25-µm CMOS high frequency.