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[Keyword] force field(2hit)

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  • Chaos and Synchronization - Potential Ingredients of Innovation in Analog Circuit Design? Open Access

    Ludovico MINATI  

     
    INVITED PAPER

      Pubricized:
    2024/03/11
      Vol:
    E107-C No:10
      Page(s):
    376-391

    Recent years have seen a general resurgence of interest in analog signal processing and computing architectures. In addition, extensive theoretical and experimental literature on chaos and analog chaotic oscillators exists. One peculiarity of these circuits is the ability to generate, despite their structural simplicity, complex spatiotemporal patterns when several of them are brought towards synchronization via coupling mechanisms. While by no means a systematic survey, this paper provides a personal perspective on this area. After briefly covering design aspects and the synchronization phenomena that can arise, a selection of results exemplifying potential applications is presented, including in robot control, distributed sensing, reservoir computing, and data augmentation. Despite their interesting properties, the industrial applications of these circuits remain largely to be realized, seemingly due to a variety of technical and organizational factors including a paucity of design and optimization techniques. Some reflections are given regarding this situation, the potential relevance to discontinuous innovation in analog circuit design of chaotic oscillators taken both individually and as synchronized networks, and the factors holding back the transition to higher levels of technology readiness.

  • Field Configurable Self-Assembly: A New Heterogeneous Integration Technology

    Alan O'RIORDAN  Gareth REDMOND  Thierry DEAN  Mathias PEZ  

     
    INVITED PAPER

      Vol:
    E86-C No:10
      Page(s):
    1977-1984

    Field Configurable Self-assembly is a novel programmable force field based heterogeneous integration technology. Herein, we demonstrate application of the method to rapid, parallel assembly of similar and dissimilar sub-200 µm GaAs-based light emitting diodes at silicon chip substrates. We also show that the method is compatible with post-process collective wiring techniques for fully planar hybrid integration of active devices.