Fiber-optic MEMS which is fabricated by combining direct photo-lithography of optical fiber and silicon micro-machining is proposed. Preliminary results of micro-machining of optical fiber and variable telecommunication devices are presented.

In this paper we present a complete methodology for efficient electro-mechanical characterization of a CMOS compatible MEMS technology. Using an original test structure, the so-called "U-shape cantilever beam," we are able to determine all mechanical characteristics of force sensors constituted with elementary beams in a given technology. A complete set of electro-mechanical relations for the design of Microsystems have also been developed.