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Hiroki WATANABE Satoru MIMA Shugo OGURI Mitsuhiro YOSHIDA Masashi HAZUMI Hirokazu ISHINO Hikaru ISHITSUKA Atsuko KIBAYASHI Chiko OTANI Nobuaki SATO Osamu TAJIMA Nozomu TOMITA
Antenna-coupled kinetic inductance detectors (KIDs) have recently shown great promise as microwave detection systems with a large number of channels. However, this technique, still has difficulties in eliminating the radiation loss of the resonator signals. To solve this problem, we propose a design in which the absorption area connected to an antenna is located on the ground-side of a coplanar waveguide. Thereby, radiation loss due to leakage from the resonator to the antenna can be considerably reduced. This simple design also enables the use of a contact aligner for fabrication. We have developed KIDs with this design, named as the ground-side absorption (GSA)-KIDs and demonstrated that they have higher quality factors than those of the existing KIDs, while maintaining a good total sensitivity.
Goji NAKAGAWA Yutaka KAI Kyosuke SONE Setsuo YOSHIDA Shinsuke TANAKA Ken MORITO Susumu KINOSHITA
We have designed and fabricated a compact 4-array integrated SOA module using a novel parallel optical coupling scheme and polarization-insensitive built-in array isolators. We achieved ultra-high On/Off extinction ratio of more than 60 dB and low cross talk of better than -60 dB as well as high-isolation of over 47 dB in wide wavelength ranges. We also developed a wavelength-insensitive parallel optical coupling scheme and an efficient thermal dissipating structure for a 4-array SOA module. We applied these technologies into 4-array SOA module fabrication and demonstrated a uniform optical coupling with the loss variance of 1 dB over the 140-nm wavelength ranges. We also demonstrated simultaneous operation of 300 mA 4 channels with low thermal degradation of the module gain less than 1 dB.
Kazuhiro TANAKA Seimi SASAKI Gohji NAKAGAWA Tsuyoshi YAMAMOTO Kazunori MIURA Shouichi OGITA Mitsuhiro YANO
Laser module fabricated with silicon platform technology is very attractive for low-cost modules. The technology enables passive optical alignment of an LD to an optical fiber. Our marker design for passive alignment allows positioning accuracy within 1 µm of LD. However, coupling efficiency is a key issue because that by conventional butt coupling scheme is low with about 10 dB coupling loss. We investigated optical coupling characteristics in various types of coupling scheme: conventional flat end fibers, cone fibers, integrated GRIN rod lenses on the platform and the coupling with new-type LDs integrated with spot size transformer. Improvement of coupling efficiency with 3 dB and 7.5 dB compared to flat-end fiber is achieved by using the cone fiber and the GRIN rod lens, respectively, although 1-dB coupling tolerances for alignment deteriorated with these schemes. We obtained high efficient coupling with 3.5 dB coupling loss and wide alignment tolerance of 2.3 µm simultaneously with a new-type LD integrated with spot size transformer owing to its expanded spot size characteristics.
Tatsuya SHIMIZU Masashi NAKATSUGAWA Hiroyuki OHTSUKA
This paper presents the performance of a proposed GaAs MESFET photodetector with wide drain-to-gate distances for improving the optical coupling efficiency in subcarrier optical transmission. Principle and design parameters of the proposed MESFET are described. Link gain, CNR, and BER, are experimentally investigated as functions of the drain-to-gate distance. It is experimentally found that the proposed MESFET improves the link gain by 8.5 dB compared to the conventional structure at the subcarrier frequency of 140 MHz. Discussions are also included compared to PIN-PD.
Seimi SASAKI Gohji NAKAGAWA Kazuhiro TANAKA Kazunori MIURA Mituhiro YANO
We proposed a new marker design for passive alignment of a laser to a fiber on a silicon waferboard. Our fiducial marker is simple form and easy to fabricate. With a unique marker design, high accurate positioning of the laser chip is easily achieved using a conventional flip-chip bonder. We have successfully fabricated laser modules with uniform coupling, within 1 dB for a flat end single-mode fiber and within 2 dB for a hemispherical end fiber. This assembly method offers the potential for low-cost optical module packaging.