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[Keyword] oscillation frequency(4hit)

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  • E-Band Low-Noise Amplifier MMICs Using Nanogate InGaAs/InAlAs HEMT Technology

    Issei WATANABE  Akira ENDOH  Takashi MIMURA  Toshiaki MATSUI  

     
    PAPER-III-V High-Speed Devices and Circuits

      Vol:
    E93-C No:8
      Page(s):
    1251-1257

    E-band low-noise amplifier (LNA) monolithic millimeter-wave integrated circuits (MMICs) were developed using pseudomorphic In0.75Ga0.25As/In0.52Al0.48As high electron mobility transistors (HEMTs) with a gate length of 50 nm. The nanogate HEMTs demonstrated a maximum oscillation frequency (fmax) of 550 GHz and a current-gain cutoff frequency (fT) of 450 GHz at room temperature, which is first experimental demonstration that fmax as high as 550 GHz are achievable with the improved one-step-recessed gate procedure. Furthermore, using a three-stage LNA-MMIC with 50-nm-gate InGaAs/InAlAs HEMTs, we achieved a minimum noise figure of 2.3 dB with an associated gain of 20.6 dB at 79 GHz.

  • Wave Propagation Phenomena of Phase States in Oscillators Coupled by Inductors as a Ladder

    Masayuki YAMAUCHI  Masahiro WADA  Yoshifumi NISHIO  Akio USHIDA  

     
    PAPER-Nonlinear Problems

      Vol:
    E82-A No:11
      Page(s):
    2592-2598

    In this study, wave propagation phenomena of phase states are observed at van der Pol oscillators coupled by inductors as a ladder. For the case of 17 oscillators, interesting wave propagation phenomena of phase states are found. By using the relationship between phase states and oscillation frequencies, the mechanisms of the propagation and the reflection of wave are explained. Circuit experimental results agree well with computer calculated results qualitatively.

  • High-Performance Small-Scale Collector-Up AlGaAs/GaAs HBT's with a Carbon-Doped Base Fabricated Using Oxygen-Ion Implantation

    Shoji YAMAHATA  Yutaka MATSUOKA  Tadao ISHIBASHI  

     
    PAPER

      Vol:
    E77-C No:9
      Page(s):
    1437-1443

    We report the development of high-performance small-scale AlGaAs/GaAs collector-up heterojunction bipolar transistors (C-up HBT) with a carbon (C)-doped base layer. Oxygen-ion (O+) implantation is used to define their intrinsic emitter/base junctions and zinc (Zn)-diffusion is used to lower the resistivity of their O+-implanted extrinsic base layers. The highly resistive O+-implanted AlGaAs layer in the extrinsic emitter region sufficiently suppresses electron injection even under high-forward-bias conditions, allowing high collector current densities. The use of a C-doped base is especially effective for small-scale C-up HBT's because it suppresses the undesirable turn-on voltage shift caused by base dopant diffusion in the intrinsic area around the collector-mesa perimeter that occurs during the high-temperature Zn-diffusion process after implantation. Even in a small-scale trasistor with a 2 µm2 µm collector, a current gain of 15 is obtained. A microwave transistor with a 2 µm10 µm collector has a cutoff frequency fT of 68 GHz and a maximum oscillation frequency fmax of 102 GHz. A small-scale C-up HBT with a 2 µm2 µm collector shows a higher fmax of 110 GHz due to reduced base/collector capacitance CBC and its fmax remains above 100 GHz, even at a low collector current of 1 mA. The CBC of this device is estimated to be as low as 2.2 fF. Current gain dependence on collector size is also investigated for C-up HBT's and it is found that the base recombination current around the collector-mesa perimeter reduces the current gain.

  • IC-Oriented Self-Aligned High-Performance AlGaAs/GaAs Ballistic Collection Transistors and Their Applications to High-Speed ICs

    Yutaka MATSUOKA  Shoji YAMAHATA  Satoshi YAMAGUCHI  Koichi MURATA  Eiichi SANO  Tadao ISHIBASHI  

     
    PAPER

      Vol:
    E76-C No:9
      Page(s):
    1392-1401

    This paper describes IC-oriented high-performance AlGaAs/GaAs heterojunction bipolar transistors that were fabricated to demonstrate their great potential in applications to high-speed integrated circuits. A collector structure of ballistic collection transistors with a launcher (LBCTs) shortens the intrinsic delay time of the transistors. A novel and simple self-aligned fabrication process, which features an base-metal-overlaid structure (BMO), reduces emitter- and base-resistances and collector capacitance. The combination of the thin-collector LBCT layer structure and the BMO self-alignment technology raises the average value of cutoff frequency, fT, to 160 GHz with a standard deviation as small as 4.3 GHz. By modifying collector thickness and using Pt/Ti/Pt/Au as the base ohmic contact metal in BMO-LBCTs, the maximum oscillation frequency, fmax, reaches 148 GHz with a 114 GHz fT. A 2:1 multiplexer with retiming D-type flip-flops (DFFs) at input/output stages fabricated on a wafer with the thin-collector LBCT structure operates at 19 Gbit/s. A monolithic preamplifier fabricated on the same wafer has a transimpedance of 52 dBΩ with a 3-dB-down bandwidth of 18.5 GHz and a gain S21 OF 21 dB with a 3-dB-down bandwidth of 19 GHz. Finally, a 40 Gbit/s selector IC and a 50 GHz dynamic frequency divider that were successfully fabricated using the 148-GHz fmax technologies are described.