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Scott T. DUNHAM Alp H. GENCER Srinivasan CHAKRAVARTHI
Recent years have seen great advances in our understanding and modeling of the coupled diffusion of dopants and defects in silicon during integrated circuit fabrication processes. However, the ever-progressing shrinkage of device dimensions and tolerances leads to new problems and a need for even better models. In this review, we address some of the advances in the understanding of defect-mediated diffusion, focusing on the equations and parameters appropriate for modeling of dopant diffusion in submicron structures.
Shigetaka KUMASHIRO Hironori SAKAMOTO Kiyoshi TAKEUCHI
This paper reports the evaluation results of the channel boron distribution in the deep sub-0.1 [µm] n-MOSFETs for the first time. It has been found that the boron depletion effect becomes dominant and the reverse short channel effect becomes less significant in the deep sub-0.1 [µm] n-MOSFETs. It has been also found that the sheet charge distribution responsible for the reverse short channel effect is localized within a distance of 100 [nm] from the source/drain-extension junction.