We have studied in detail the effect of gas flow rates on the film properties of low-temperature (300) polycrystalline silicon (poly-Si) films prepared by conventional plasma enhanced chemical vapor deposition (13.56 MHz) with SiF4/SiH4/H2 gases. The effect of SiH4 flow rate on crystallization is shown to be large. A small amount of SiH4 with high SiF4 and H2 flow rates (50[H2]/[SiH4]1200, 20[SiF4]/[SiH4]150, 1[H2]/[SiF4]16) is important to form poly-Si films. The poly-Si films deposited under such optimized conditions had shown preferential 〈110〉-orientation and the crystalline fraction is estimated to be more than 80%. The deposition rates are in the range of 5-30 nm/min. The conductivity is in the range of 10-8-10-6 S/cm. Further, the electrical conduction indicates an activation type, and the activation energy is in the range of 0.5-0.6 eV.

The a-Si films deposited on quartz substrates were crystallized by lateral sweep annealing in steep temperature gradient using a gas burner. Random nucleation in amorphous region was effectively suppressed in the temperature gradient, so lateral solid phase epitaxial growth from crystallites generated at the initial stage of lateral sweep annealing spread over 100 µm. Their crystallographic orientations were mostly (100).