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[Keyword] power clamp(2hit)

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  • Design of SCR-Based ESD Protection Device for Power Clamp Using Deep-Submicron CMOS Technology

    Yongseo KOO  

     
    PAPER-Electronic Circuits

      Vol:
    E92-C No:9
      Page(s):
    1188-1193

    The novel SCR-based (silicon controlled rectifier) device for ESD power clamp is presented in this paper. The proposed device has a high holding voltage and a high triggering current characteristic. These characteristics enable latch-up immune normal operation as well as superior full chip ESD protection. The device has a small area in requirement robustness in comparison to ggNMOS (gate grounded NMOS). The proposed ESD protection device is designed in 0.25 µm and 0.5 µm CMOS Technology. In the experimental result, the proposed ESD clamp has a double trigger characteristic, a high holding voltage of 4 V and a high trigger current of above 350 mA. The robustness has measured to HBM 8 kV (HBM: Human Body Model) and MM 400 V (MM: Machine Model). The proposed device has a high level It2 of 52 mA/ µm approximately.

  • A Latchup-Free ESD Power Clamp Circuit with Stacked-Bipolar Devices for High-Voltage Integrated Circuits

    Jae-Young PARK  Jong-Kyu SONG  Chang-Soo JANG  San-Hong KIM  Won-Young JUNG  Taek-Soo KIM  

     
    PAPER

      Vol:
    E92-C No:5
      Page(s):
    671-675

    The holding voltage of high-voltage devices under the snapback breakdown condition has been known to be much smaller than the power supply voltage. Such characteristics cause high-voltage ICs to be susceptible to the transient latch-up failure in the practical system applications, especially when these devices are used as the ESD power clamp circuit. A new latchup-free design of the ESD power clamp circuit with stacked-bipolar devices is proposed and successfully verified in a 0.35 µm BCD (Bipolar-CMOS-DMOS) process to achieve the desired ESD level. The total holding voltage of the stacked-bipolar devices in the snapback breakdown condition can be larger than the power supply voltage.