This work elucidates the evolution of three generations of the laboratory information system in the National Taiwan University Hospital, which were respectively implemented in an IBM Series/1 minicomputer, a client/server and a plug-and-play HL7 interface engine environment respectively. The experience of using the HL7 healthcare information exchange in the hospital information system, laboratory information system, and automatic medical instruments over the past two decades are illustrated and discussed. The latest design challenge in developing intelligent laboratory information services is to organize effectively distributed and heterogeneous medical instruments through the message gateways. Such experiences had spread to some governmental information systems for different purposes in Taiwan; besides, the healthcare information exchange standard, software reuse mechanism, and application service provider adopted in developing the plug-and-play laboratory information system are also illustrated.

A cryocooled system with I/O interface circuits, which enables high-speed system operation of superconductive single-flux-quantum (SFQ) circuits at over 40 GHz, and the demonstration of a 47-Gbps SFQ 22 switch system are presented. The cryocooled system has 32 I/Os and cools an SFQ multi-chip module (MCM) to 4 K with a two-stage 1-W Gifford-McMahon cryocooler. An SFQ 4:1 multiplexer (MUX) and an SFQ 1:4 demultiplexer (DEMUX) have been designed to interface the speed gap between the I/O (~10 Gbps/ch) and SFQ circuits (>40 GHz). An SFQ 22 switch chip, in which the MUX/DEMUX and an SFQ 22 switch are integrated, and an 8-channel superconductive voltage driver (SVD) chip have been designed with an advanced cell library for a junction critical current density of 10 kA/cm2. An SFQ 22 switch MCM has been made by flip-chip bonding the switch chip and SVD chip on a superconductive MCM carrier with φ 50-µm InSn solder bumps. An SFQ 22 switch system, which is the switch MCM packaged in the cryocooled system, has been demonstrated up to a port speed of 47 Gbps for the first time.

Various kinds of new architectures have been proposed to enhance operating performance of the DRAM. This paper reviews these architectures including EDO, SDRAM, RDRAM, EDRAM, and CDRAM. The EDO slightly modifies the output control of the conventional DRAM architecture. Other innovative architectures try to enhance the performance by taking advantage of DRAM's internal multiple bits architecture with internal pipeline, parallel-serial conversion, or static buffers/on-chip cache. A quantitative analysis based on an assumption of wait cycles was made to compare PC system performance with some architectures. The calculation indicated the effectiveness of external or on-chip cache. Future trends cover high-speed I/O interface, unified memory architecture, and system integrated memory. The interface includes limited I/O swing such as HSTL and SSTL to realize more than 100MHz operation. Also, Ramlink and SyncLink are briefly reviewed as candidates for next generation interface. Unified memory architecture attempts to save total memory capacity by combining graphics and main memory. Advanced device technology enables system integration which combine system logic and memory. It suggests one potential direction towards system on a chip in the future.