This paper formulates minimal word-line (WL) delay time with pre-emphasis pulses to design the pulse width as a function of the overdrive voltage for large memory arrays such as 3D NAND. Circuit theory for a single RC line only with capacitance to ground and that only with coupling capacitance as well as a general case where RC lines have both grounded and coupling capacitance is discussed to provide an optimum pre-emphasis pulse width to minimize the delay time. The theory is expanded to include the cases where the resistance of the RC line driver is not negligibly small. The minimum delay time formulas of a single RC delay line and capacitive coupling RC lines was in good agreement (i.e. within 5% error) with measurement. With this research, circuit designers can estimate an optimum pre-emphasis pulse width and the delay time for an RC line in the initial design phase.

To achieve low-voltage low-power SRAMs, two proposals are demonstrated. One is a multi-power-supply five-transistor cell (5T cell), assisted by a boosted word-line voltage and a mid-point sensing enabled by precharging bit-lines to VDD/2. The cell enables to reduce VDD to 0.5V or less for a given speed, or enhance speed for a given VDD. The other is a partial activation of a compact multi-divided open-bit-line array for low power. Layout and post-layout simulation with a 28-nm fully-depleted planar-logic SOI MOSFET reveal that a 0.5-V 5T-cell 4-kb array in a 128-kb SRAM core using the proposals is able to achieve x2-3 faster cycle time and x11 lower power than the counterpart 6T-cell array, suggesting a possibility of a 730-ps cycle time at 0.5V.

A design rule relaxation approach is one of the most important requirements for high density DRAMs. The approach relaxes the design rule of a element in comparison with the memory cell size and provides high density DRAMs with the minimum development of a scaled-down MOS structure and a fine patterning lithography process. This paper describes two design rule relaxation approaches, a close-packed folded (CPF) bit-line cell array layout and a Boosted Dual Word-Line scheme. The CPF cell array provides 1.26 times wider active area pitch and maximum 1.5 times wider isolation width. The Boosted Dual Word-Line scheme provides 2n times wider 1st Al pitch on memory cell array, double word-line driver pitch and 1.5 times larger design rule for 1st Al and contacts under 1st Al. Especially wide design rule of the Boosted Dual Word-Line scheme provides several times depth of focus (DOF) for 1st Al wiring which gives several times higher storage node and larger capacitance for capacitor over bit-line (COB) stacked capacitor cells. These approaches are successfully implemented in a 4 Mb DRAM test chip with a 0.91.8 µm2 memory cell.