Three-dimensional integrated circuits (3D ICs) that employ through-silicon vias (TSVs) integrating multiple dies vertically have opened up the potential of highly improved circuit designs. However, various types of TSV defects may occur during the assembly process, especially the clustered TSV faults because of the winding level of thinned wafer, the surface roughness and cleanness of silicon dies,inducing TSV yield reduction greatly. To tackle this fault clustering problem, router-based and ring-based TSV redundancy architectures were previously proposed. However, these schemes either require too much area overhead or have limited reparability to tolerant clustered TSV faults. Furthermore, the repairing lengths of these schemes are too long to be ignored, leading to additional delay overhead, which may cause timing violation. In this paper, we propose a region-based TSV redundancy design to achieve relatively high reparability as well as low additional delay overhead. Simulation results show that for a given number of TSVs (8*8) and TSV failure rate (1%), our design achieves 11.27% and 20.79% reduction of delay overhead as compared with router-based design and ring-based scheme, respectively. In addition, the reparability of our proposed scheme is much better than ring-based design by 30.84%, while it is close to that of the router-based scheme. More importantly, the overall TSV yield of our design achieves 99.88%, which is slightly higher than that of both router-based method (99.53%) and ring-based design (99.00%).

Device mismatch plays an important role in the design of accurate analog circuits. The common centroid structure is commonly employed to reduce device mismatches caused by symmetrical layouts and processing gradients. Among the candidate placements generated by the common centroid approach, however, whichever achieves better matching is generally difficult to be determined without performing the time-consuming yield evaluation process. In addition, this rule-based methodology makes it difficult to achieve acceptable matching between multiple capacitors and to handle an irregular layout area. Based on a spatial correlation model, this study proposed a design methodology for yield enhancement of analog circuits using switched-capacitor techniques. An efficient and effective placement generator is developed to derive a placement for a circuit to achieve the highest or near highest correlation coefficient and thus accomplishing a better yield performance. A simple yield analysis is also developed to evaluate the achieved yield performance of a derived placement. Results show that the proposed methodology derives a placement which achieves better yield performance than those generated by the common centroid approach.

As VLSI technology has developed, the interest in implementing an entire or significant part of a parallel computer system using wafer scale integration is growing. The major problem for the case is the possibility of drastically low yield and/or reliability of the system if there is no strategy for coping with such situations. Various strategies to restructure the faulty physical system into the fault-free target logical system are described in the literature [1]-[5]. In this paper, we propose an efficient approximate method which can reconstruct the 1 1/2 track-switch mesh arrays with faulty PEs using hardware as well as software. A logical circuit added to each PE and a network connecting the circuits are used to decide spare PEs which compensate for faulty PEs. The hardware compexity of each circuit is much less than that of a PE where the size of each additional circuit is independent of array sizes and constant. By using the exclusive hardware scheme, a built-in self-reconfigurable system without using a host computer is realizable and the time for reconfiguring arrays becomes very short. The simulation result of the performance of the method shows that the reconstructing efficiency of our algorithm is a little less than those of the exaustive and Shigei's ones [6] and [7], but much better than that of the neural one [3]. We also compare the time complexities of reconstructions by hardware as well as software, and the hardware complexity in terms of the number of gates in the logical circuit added to each PE among the other methods.