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IEICE TRANSACTIONS on Communications

Manufacture and Performance of a 60GHz-Band High-Efficiency Antenna with a Thick Resin Layer and the Feed through a Hole in a Silicon Chip

Jun ASANO, Jiro HIROKAWA, Hiroshi NAKANO, Yasutake HIRACHI, Hiroshi ISONO, Atsushi ISHII, Makoto ANDO

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Summary :

As a first step towards the realization of high-efficiency on-chip antennas for 60GHz-band wireless personal area networks, this paper proposes the fabrication of a patch antenna placed on a 200µm thick dielectric resin and fed through a hole in a silicon chip. Despite the large tan δ of the adopted material (0.015 at 50GHz), the thick resin reduces the conductor loss at the radiating element and a radiation efficiency of 78%, which includes the connecting loss from the bottom is predicted by simulation. This calculated value is verified in the millimeter-wave band by experiments in a reverberation chamber. Six stirrers are installed, one on each wall in the chamber, to create a statistical Rayleigh environment. The manufactured prototype antenna with a test jig demonstrates the radiation efficiency of 75% in the reverberation chamber. This agrees well with the simulated value of 76%, while the statistical measurement uncertainty of our handmade reverberation chamber is calculated as ±0.14dB.

Publication
IEICE TRANSACTIONS on Communications Vol.E96-B No.12 pp.3108-3115
Publication Date
2013/12/01
Publicized
Online ISSN
1745-1345
DOI
10.1587/transcom.E96.B.3108
Type of Manuscript
PAPER
Category
Antennas and Propagation

Authors

Jun ASANO
  Tokyo Institute of Technology
Jiro HIROKAWA
  Tokyo Institute of Technology
Hiroshi NAKANO
  Ammsys Inc.
Yasutake HIRACHI
  Ammsys Inc.
Hiroshi ISONO
  Shiima Electronics Inc.
Atsushi ISHII
  Shiima Electronics Inc.
Makoto ANDO
  Tokyo Institute of Technology

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