Microwave-Circuit-Embedded Resin Printed Circuit Board for Short Range Wireless Interfaces

Akira SAITOU; Kazuhiko HONJO; Kenichi SATO; Toyoko KOYAMA; Koichi WATANABE

doi:10.1093/ietele/e88-c.1.83

Microwave-Circuit-Embedded Resin Printed Circuit Board for Short Range Wireless Interfaces

Akira SAITOU, Kazuhiko HONJO, Kenichi SATO, Toyoko KOYAMA, Koichi WATANABE

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Microwave circuits embedded in a multi-layer resin PCB are demonstrated using low loss resin materials. Resin materials for microwave frequencies were compared with conventional FR-4 with respect to dielectric and conductor loss factors, which proved that losses could be reduced drastically with the low loss material and design optimizations. Baluns, switches and BPFs were designed and fabricated to estimate microwave performances. Measured and simulated insertion losses of the circuits for 2.5 GHz band, were 0.3 dB for a switch, 0.4 dB for a balun and 2.0 dB for a 3-stage Chebyshev BPF. An integration of a switch, a BPF and two baluns was successfully implemented in a multi-layer PCB. Insertion losses of the fabricated integrated circuit were less than 3 dB with 0.1 dB additional loss compared with a sum of individual circuit losses. With estimated results of temperature characteristics and reliability as well as low loss performances, microwave circuits in resin PCBs can be considered as a viable candidate for microwave equipments.

Publication: IEICE TRANSACTIONS on Electronics Vol.E88-C No.1 pp.83-88

Publication Date: 2005/01/01

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DOI: 10.1093/ietele/e88-c.1.83

Type of Manuscript: Special Section PAPER (Special Section on Recent Trends of Microwave and Millimeter-Wave Passive Circuit Components and Technologies for Improvement of Characteristics)

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Akira SAITOU, Kazuhiko HONJO, Kenichi SATO, Toyoko KOYAMA, Koichi WATANABE, "Microwave-Circuit-Embedded Resin Printed Circuit Board for Short Range Wireless Interfaces" in IEICE TRANSACTIONS on Electronics, vol. E88-C, no. 1, pp. 83-88, January 2005, doi: 10.1093/ietele/e88-c.1.83.
Abstract: Microwave circuits embedded in a multi-layer resin PCB are demonstrated using low loss resin materials. Resin materials for microwave frequencies were compared with conventional FR-4 with respect to dielectric and conductor loss factors, which proved that losses could be reduced drastically with the low loss material and design optimizations. Baluns, switches and BPFs were designed and fabricated to estimate microwave performances. Measured and simulated insertion losses of the circuits for 2.5 GHz band, were 0.3 dB for a switch, 0.4 dB for a balun and 2.0 dB for a 3-stage Chebyshev BPF. An integration of a switch, a BPF and two baluns was successfully implemented in a multi-layer PCB. Insertion losses of the fabricated integrated circuit were less than 3 dB with 0.1 dB additional loss compared with a sum of individual circuit losses. With estimated results of temperature characteristics and reliability as well as low loss performances, microwave circuits in resin PCBs can be considered as a viable candidate for microwave equipments.
URL: https://global.ieice.org/en_transactions/electronics/10.1093/ietele/e88-c.1.83/_p

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@ARTICLE{e88-c_1_83,
author={Akira SAITOU, Kazuhiko HONJO, Kenichi SATO, Toyoko KOYAMA, Koichi WATANABE, },
journal={IEICE TRANSACTIONS on Electronics},
title={Microwave-Circuit-Embedded Resin Printed Circuit Board for Short Range Wireless Interfaces},
year={2005},
volume={E88-C},
number={1},
pages={83-88},
abstract={Microwave circuits embedded in a multi-layer resin PCB are demonstrated using low loss resin materials. Resin materials for microwave frequencies were compared with conventional FR-4 with respect to dielectric and conductor loss factors, which proved that losses could be reduced drastically with the low loss material and design optimizations. Baluns, switches and BPFs were designed and fabricated to estimate microwave performances. Measured and simulated insertion losses of the circuits for 2.5 GHz band, were 0.3 dB for a switch, 0.4 dB for a balun and 2.0 dB for a 3-stage Chebyshev BPF. An integration of a switch, a BPF and two baluns was successfully implemented in a multi-layer PCB. Insertion losses of the fabricated integrated circuit were less than 3 dB with 0.1 dB additional loss compared with a sum of individual circuit losses. With estimated results of temperature characteristics and reliability as well as low loss performances, microwave circuits in resin PCBs can be considered as a viable candidate for microwave equipments.},
keywords={},
doi={10.1093/ietele/e88-c.1.83},
ISSN={},
month={January},}

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TY - JOUR
TI - Microwave-Circuit-Embedded Resin Printed Circuit Board for Short Range Wireless Interfaces
T2 - IEICE TRANSACTIONS on Electronics
SP - 83
EP - 88
AU - Akira SAITOU
AU - Kazuhiko HONJO
AU - Kenichi SATO
AU - Toyoko KOYAMA
AU - Koichi WATANABE
PY - 2005
DO - 10.1093/ietele/e88-c.1.83
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E88-C
IS - 1
JA - IEICE TRANSACTIONS on Electronics
Y1 - January 2005
AB - Microwave circuits embedded in a multi-layer resin PCB are demonstrated using low loss resin materials. Resin materials for microwave frequencies were compared with conventional FR-4 with respect to dielectric and conductor loss factors, which proved that losses could be reduced drastically with the low loss material and design optimizations. Baluns, switches and BPFs were designed and fabricated to estimate microwave performances. Measured and simulated insertion losses of the circuits for 2.5 GHz band, were 0.3 dB for a switch, 0.4 dB for a balun and 2.0 dB for a 3-stage Chebyshev BPF. An integration of a switch, a BPF and two baluns was successfully implemented in a multi-layer PCB. Insertion losses of the fabricated integrated circuit were less than 3 dB with 0.1 dB additional loss compared with a sum of individual circuit losses. With estimated results of temperature characteristics and reliability as well as low loss performances, microwave circuits in resin PCBs can be considered as a viable candidate for microwave equipments.
ER -