Characterizing Film Quality and Electromigration Resistance of Giant-Grain Copper Interconnects
Summary :
The performance of copper interconnects formed by the low-kinetic-energy ion bombardment process has been investigated. The copper films formed on SiO2 by this technology under a sufficient amount of ion energy deposition exhibit perfect orientation conversion from Cu (111) to Cu (100) upon post-metallization thermal annealing. We have discovered such crystal orientation conversion is always accompanied by a giant-grain growth as large as 100 µm. The copper film resistivity decreases due to the decrease in the grain boundary scattering, when the giant-grain growth occurs in the film. The resistivity of giant-grain copper film at a room temperature is 1.76 µΩcm which is almost equal to the bulk resistivity of copper. Furthermore, a new-accelerated electromigration life-test method has been developed to evaluate copper interconnects having large electromigration resistance within a very short period of test time. The essence of the new method is the acceleration by a large-current-stress of more than 107 A/cm2 and to utilize the self heating of test interconnect for giving temperature stress. In order to avoid uncontrollable thermal runaway and resultant interconnect melting, we adopted a very efficient cooling system that immediately removes Joule heat and keeps the interconnect temperature constant. As a result, copper interconnects formed by the low-kinetic-energy ion bombardment process exhibit three orders of magnitude longer lifetime at 300 K than Al alloy interconnects.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E76-C No.4 pp.626-634
- Publication Date
- 1993/04/25
- Publicized
- Online ISSN
- DOI
- Type of Manuscript
- Special Section PAPER (Special Issue on Sub-Half Micron Si Device and Process Technologies)
- Category
- Process Technology
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Takahisa NITTA, Tadahiro OHMI, Tsukasa HOSHI, Toshiyuki TAKEWAKI, Tadashi SHIBATA, "Characterizing Film Quality and Electromigration Resistance of Giant-Grain Copper Interconnects" in IEICE TRANSACTIONS on Electronics,
vol. E76-C, no. 4, pp. 626-634, April 1993, doi: .
Abstract: The performance of copper interconnects formed by the low-kinetic-energy ion bombardment process has been investigated. The copper films formed on SiO2 by this technology under a sufficient amount of ion energy deposition exhibit perfect orientation conversion from Cu (111) to Cu (100) upon post-metallization thermal annealing. We have discovered such crystal orientation conversion is always accompanied by a giant-grain growth as large as 100 µm. The copper film resistivity decreases due to the decrease in the grain boundary scattering, when the giant-grain growth occurs in the film. The resistivity of giant-grain copper film at a room temperature is 1.76 µΩcm which is almost equal to the bulk resistivity of copper. Furthermore, a new-accelerated electromigration life-test method has been developed to evaluate copper interconnects having large electromigration resistance within a very short period of test time. The essence of the new method is the acceleration by a large-current-stress of more than 107 A/cm2 and to utilize the self heating of test interconnect for giving temperature stress. In order to avoid uncontrollable thermal runaway and resultant interconnect melting, we adopted a very efficient cooling system that immediately removes Joule heat and keeps the interconnect temperature constant. As a result, copper interconnects formed by the low-kinetic-energy ion bombardment process exhibit three orders of magnitude longer lifetime at 300 K than Al alloy interconnects.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e76-c_4_626/_p
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@ARTICLE{e76-c_4_626,
author={Takahisa NITTA, Tadahiro OHMI, Tsukasa HOSHI, Toshiyuki TAKEWAKI, Tadashi SHIBATA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Characterizing Film Quality and Electromigration Resistance of Giant-Grain Copper Interconnects},
year={1993},
volume={E76-C},
number={4},
pages={626-634},
abstract={The performance of copper interconnects formed by the low-kinetic-energy ion bombardment process has been investigated. The copper films formed on SiO2 by this technology under a sufficient amount of ion energy deposition exhibit perfect orientation conversion from Cu (111) to Cu (100) upon post-metallization thermal annealing. We have discovered such crystal orientation conversion is always accompanied by a giant-grain growth as large as 100 µm. The copper film resistivity decreases due to the decrease in the grain boundary scattering, when the giant-grain growth occurs in the film. The resistivity of giant-grain copper film at a room temperature is 1.76 µΩcm which is almost equal to the bulk resistivity of copper. Furthermore, a new-accelerated electromigration life-test method has been developed to evaluate copper interconnects having large electromigration resistance within a very short period of test time. The essence of the new method is the acceleration by a large-current-stress of more than 107 A/cm2 and to utilize the self heating of test interconnect for giving temperature stress. In order to avoid uncontrollable thermal runaway and resultant interconnect melting, we adopted a very efficient cooling system that immediately removes Joule heat and keeps the interconnect temperature constant. As a result, copper interconnects formed by the low-kinetic-energy ion bombardment process exhibit three orders of magnitude longer lifetime at 300 K than Al alloy interconnects.},
keywords={},
doi={},
ISSN={},
month={April},}
Copy
TY - JOUR
TI - Characterizing Film Quality and Electromigration Resistance of Giant-Grain Copper Interconnects
T2 - IEICE TRANSACTIONS on Electronics
SP - 626
EP - 634
AU - Takahisa NITTA
AU - Tadahiro OHMI
AU - Tsukasa HOSHI
AU - Toshiyuki TAKEWAKI
AU - Tadashi SHIBATA
PY - 1993
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E76-C
IS - 4
JA - IEICE TRANSACTIONS on Electronics
Y1 - April 1993
AB - The performance of copper interconnects formed by the low-kinetic-energy ion bombardment process has been investigated. The copper films formed on SiO2 by this technology under a sufficient amount of ion energy deposition exhibit perfect orientation conversion from Cu (111) to Cu (100) upon post-metallization thermal annealing. We have discovered such crystal orientation conversion is always accompanied by a giant-grain growth as large as 100 µm. The copper film resistivity decreases due to the decrease in the grain boundary scattering, when the giant-grain growth occurs in the film. The resistivity of giant-grain copper film at a room temperature is 1.76 µΩcm which is almost equal to the bulk resistivity of copper. Furthermore, a new-accelerated electromigration life-test method has been developed to evaluate copper interconnects having large electromigration resistance within a very short period of test time. The essence of the new method is the acceleration by a large-current-stress of more than 107 A/cm2 and to utilize the self heating of test interconnect for giving temperature stress. In order to avoid uncontrollable thermal runaway and resultant interconnect melting, we adopted a very efficient cooling system that immediately removes Joule heat and keeps the interconnect temperature constant. As a result, copper interconnects formed by the low-kinetic-energy ion bombardment process exhibit three orders of magnitude longer lifetime at 300 K than Al alloy interconnects.
ER -
English
