Failure Analysis in Si Device Chips
Summary :
Recent developments and case studies regarding VLSI device chip failure analysis are reviewed. The key failure analysis techniques reviewed include EMMS (emission microscopy), OBIC (optical beam induced current), LCM (liquid crystal method), EBP (electron beam probing), and FIB (focused ion beam method). Further, future possibilities in failure analysis, and some promising new tools are introduced.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E77-C No.4 pp.528-534
- Publication Date
- 1994/04/25
- Publicized
- Online ISSN
- DOI
- Type of Manuscript
- Special Section INVITED PAPER (Special Issue on LSI Failure Analysis)
- Category
Authors
Keyword
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Kiyoshi NIKAWA, "Failure Analysis in Si Device Chips" in IEICE TRANSACTIONS on Electronics,
vol. E77-C, no. 4, pp. 528-534, April 1994, doi: .
Abstract: Recent developments and case studies regarding VLSI device chip failure analysis are reviewed. The key failure analysis techniques reviewed include EMMS (emission microscopy), OBIC (optical beam induced current), LCM (liquid crystal method), EBP (electron beam probing), and FIB (focused ion beam method). Further, future possibilities in failure analysis, and some promising new tools are introduced.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e77-c_4_528/_p
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@ARTICLE{e77-c_4_528,
author={Kiyoshi NIKAWA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Failure Analysis in Si Device Chips},
year={1994},
volume={E77-C},
number={4},
pages={528-534},
abstract={Recent developments and case studies regarding VLSI device chip failure analysis are reviewed. The key failure analysis techniques reviewed include EMMS (emission microscopy), OBIC (optical beam induced current), LCM (liquid crystal method), EBP (electron beam probing), and FIB (focused ion beam method). Further, future possibilities in failure analysis, and some promising new tools are introduced.},
keywords={},
doi={},
ISSN={},
month={April},}
Copy
TY - JOUR
TI - Failure Analysis in Si Device Chips
T2 - IEICE TRANSACTIONS on Electronics
SP - 528
EP - 534
AU - Kiyoshi NIKAWA
PY - 1994
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E77-C
IS - 4
JA - IEICE TRANSACTIONS on Electronics
Y1 - April 1994
AB - Recent developments and case studies regarding VLSI device chip failure analysis are reviewed. The key failure analysis techniques reviewed include EMMS (emission microscopy), OBIC (optical beam induced current), LCM (liquid crystal method), EBP (electron beam probing), and FIB (focused ion beam method). Further, future possibilities in failure analysis, and some promising new tools are introduced.
ER -
English
