IEICE TRANSACTIONS on Electronics
Copper Thick Film Conductor for Aluminum Nitride Substrates
Summary :
A copper(Cu) thick film conductor containing glass and metal oxide for aluminum niride(AlN) substrate was developed. The conductor showed adhesion strength and reliability which were almost comparable to those of Ag-Pd conductors and also had good solder wettability and erosion properties. The Cu conductors must be fired in a nitrogen atmosphere containing oxygen gas. When they were fired under a low oxygen concentration, the gasses thermally decomposed and their properties changed which meant that the molten gasses could not flow smoothly to the AlN surface, so adhesion strength decreased. On the other hand, under high oxygen concentration, the adhesion strength increased because the thermal decomposition and property changes were suppressed. However, poorer solder wettability was brought about because copper was oxidized. Metal oxide added to the conductor could improve the wettability without decreasing the adhesion strength, even if it was fired at the higher oxygen concentration. Suitable metal oxides were CdO, Co3O5 and Fe2O3.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E79-C No.6 pp.845-852
- Publication Date
- 1996/06/25
- Publicized
- Online ISSN
- DOI
- Type of Manuscript
- PAPER
- Category
- Electronic Circuits
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Tsuneo ENDOH, Yasutoshi KURIHARA, "Copper Thick Film Conductor for Aluminum Nitride Substrates" in IEICE TRANSACTIONS on Electronics,
vol. E79-C, no. 6, pp. 845-852, June 1996, doi: .
Abstract: A copper(Cu) thick film conductor containing glass and metal oxide for aluminum niride(AlN) substrate was developed. The conductor showed adhesion strength and reliability which were almost comparable to those of Ag-Pd conductors and also had good solder wettability and erosion properties. The Cu conductors must be fired in a nitrogen atmosphere containing oxygen gas. When they were fired under a low oxygen concentration, the gasses thermally decomposed and their properties changed which meant that the molten gasses could not flow smoothly to the AlN surface, so adhesion strength decreased. On the other hand, under high oxygen concentration, the adhesion strength increased because the thermal decomposition and property changes were suppressed. However, poorer solder wettability was brought about because copper was oxidized. Metal oxide added to the conductor could improve the wettability without decreasing the adhesion strength, even if it was fired at the higher oxygen concentration. Suitable metal oxides were CdO, Co3O5 and Fe2O3.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e79-c_6_845/_p
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@ARTICLE{e79-c_6_845,
author={Tsuneo ENDOH, Yasutoshi KURIHARA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Copper Thick Film Conductor for Aluminum Nitride Substrates},
year={1996},
volume={E79-C},
number={6},
pages={845-852},
abstract={A copper(Cu) thick film conductor containing glass and metal oxide for aluminum niride(AlN) substrate was developed. The conductor showed adhesion strength and reliability which were almost comparable to those of Ag-Pd conductors and also had good solder wettability and erosion properties. The Cu conductors must be fired in a nitrogen atmosphere containing oxygen gas. When they were fired under a low oxygen concentration, the gasses thermally decomposed and their properties changed which meant that the molten gasses could not flow smoothly to the AlN surface, so adhesion strength decreased. On the other hand, under high oxygen concentration, the adhesion strength increased because the thermal decomposition and property changes were suppressed. However, poorer solder wettability was brought about because copper was oxidized. Metal oxide added to the conductor could improve the wettability without decreasing the adhesion strength, even if it was fired at the higher oxygen concentration. Suitable metal oxides were CdO, Co3O5 and Fe2O3.},
keywords={},
doi={},
ISSN={},
month={June},}
Copy
TY - JOUR
TI - Copper Thick Film Conductor for Aluminum Nitride Substrates
T2 - IEICE TRANSACTIONS on Electronics
SP - 845
EP - 852
AU - Tsuneo ENDOH
AU - Yasutoshi KURIHARA
PY - 1996
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E79-C
IS - 6
JA - IEICE TRANSACTIONS on Electronics
Y1 - June 1996
AB - A copper(Cu) thick film conductor containing glass and metal oxide for aluminum niride(AlN) substrate was developed. The conductor showed adhesion strength and reliability which were almost comparable to those of Ag-Pd conductors and also had good solder wettability and erosion properties. The Cu conductors must be fired in a nitrogen atmosphere containing oxygen gas. When they were fired under a low oxygen concentration, the gasses thermally decomposed and their properties changed which meant that the molten gasses could not flow smoothly to the AlN surface, so adhesion strength decreased. On the other hand, under high oxygen concentration, the adhesion strength increased because the thermal decomposition and property changes were suppressed. However, poorer solder wettability was brought about because copper was oxidized. Metal oxide added to the conductor could improve the wettability without decreasing the adhesion strength, even if it was fired at the higher oxygen concentration. Suitable metal oxides were CdO, Co3O5 and Fe2O3.
ER -
English
