In this study, the microwave dielectric properties of the Mg4Ta2O9 and Mg5Ta4O15 ceramics with composition ratio and sintering temperature were investigated and the dielectric resonators with these ceramics were simulated. TiO2 was doped in the Mg4Ta2O9 ceramics for improvement of temperature property. The (1-x)Mg4Ta2O9-xTiO2 and Mg5Ta4O15 ceramics were prepared by solid-state reaction method. According to the X-ray diffraction data, the (1-x)Mg4Ta2O9-xTiO2 ceramics had main phase of the Mg4Ta2O9 and MgTi2O5 peaks were appeared by additions of TiO2. In the Mg5Ta4O15 ceramics, the Mg4Ta2O9 and MgTa2O6 phase were coexisted and Mg5Ta4O15 phase was appeared with increments of sintering temperature. Microwave dielectric properties of (1-x)Mg4Ta2O9-xTiO2 ceramics were affected by MgTi2O5 and TiO2 phase. The quality factor had a little decrement compared to pure Mg4Ta2O9, but there was excellent improvement in TCRF by addition of TiO2. Densifications of the Mg4Ta2O9 and MgTa2O6 and existence of the Mg5Ta4O15 phase had influence on the microwave dielectric properties of the Mg5Ta4O15 ceramics. Dielectric constant, quality factor and TCRF of the (1-x)Mg4Ta2O9-xTiO2 and Mg5Ta4O15 ceramics sintered at 1450 were 11.5622.5, 24980186410 GHz, -36.02+19.72 ppm/ and 8.2, 89473 GHz, -10.91 ppm/, respectively. ADS was used for simulation of DR. The simulated DR with the 0.5Mg4Ta2O9-0.5TiO2 and Mg5Ta4O15 ceramics had the S21 of -35.034 dB at 11.97 GHz and -28.493 dB at 10.50 GHz, respectively.

This paper proposes a novel fiber endface preparation tool for optical fiber joints that employs thermal surface cleaning and thermal endface cutting. This tool has great advantages in terms of fiber endface preparation time, and fiber endface stability when fiber is cut repeatedly. Stable thermal surface cleaning and thermal endface cutting are achieved by selecting suitable heating conditions. The fiber endface preparation time can be reduced to 50% of that required with conventional tools. The fiber endface stability obtained using thermal cutting is more than five times better than that obtained with the conventional tool using a blade.

Fully embedded spiral inductors in a low loss dielectric multi-layer were designed and fabricated using a low temperature co-fired ceramics (LTCC) technology for RF SIP (system in package) integrations. The line width/space and the number of spiral layers were optimized within five layers of LTCC dielectric for high Q-factor, high self-resonant frequency (SRF), process easiness, and compact size. The embedded multi-layer spiral inductors reveal better performance in terms of Q-factor, SRF and the effective inductance Leff than planar spiral inductors of the same dimension and number of turns. The optimized multi-layer spiral inductor shows maximum Q of 56, Leff of 6.6 nH at Qmax and SRF of 3.6 GHz while planar spiral inductors have maximum Q of 49, Leff of 5.8 nH at Qmax and SRF of 3.0 GHz.

A copper(Cu) thick film conductor containing glass and metal oxide for aluminum niride(AlN) substrate was developed. The conductor showed adhesion strength and reliability which were almost comparable to those of Ag-Pd conductors and also had good solder wettability and erosion properties. The Cu conductors must be fired in a nitrogen atmosphere containing oxygen gas. When they were fired under a low oxygen concentration, the gasses thermally decomposed and their properties changed which meant that the molten gasses could not flow smoothly to the AlN surface, so adhesion strength decreased. On the other hand, under high oxygen concentration, the adhesion strength increased because the thermal decomposition and property changes were suppressed. However, poorer solder wettability was brought about because copper was oxidized. Metal oxide added to the conductor could improve the wettability without decreasing the adhesion strength, even if it was fired at the higher oxygen concentration. Suitable metal oxides were CdO, Co3O5 and Fe2O3.

We deal with a new type ceramic emitter which is used in a cleanroom ionizer system and is composed of a needle-shaped silicon and a rod-shaped silicon carbide ceramics. The discharge test was carried out to investigate the particle generation from the emitter and the degradation of the emitter. As a result, it was found that the ceramic emitter had practically higher performance than a conventional tungsten emitter.

This paper presents ceramic multi-layer substrates for mobile communication using alumina-glass composite ceramics and co-fired copper conductors. Electrical characteristics in GHz frequencies of the substrate, copper conductor, transmission line, via hole and coupling between the striplines were evaluated. The results showed that the ceramic multi-layer substrate had good electrical characteristics enough for GHz-band applications. Using the ceramic multi-layer substrates, one can drastically reduce the size of RF circuit boards for mobile communication equipment.