IEICE TRANSACTIONS on Electronics
Cooling Characteristics of Small Planar Packaging System Combined with Card-On-Board Packaging for High-Speed Telecommunication Systems
Summary :
The small planar packaging (SPP) system described here can be combined with card-on-board (COB) packaging in high-speed asynchronous transfer mode (ATM) switching systems with throughput of over 40-Gb/s. The SPP system provides high I/O pin count density, high packaging density and high cooling capability. Prototype SPP system with air flow control structure for switching MCMs is constructed. Each MCM contained a 3
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E81-C No.10 pp.1639-1647
- Publication Date
- 1998/10/25
- Publicized
- Online ISSN
- DOI
- Type of Manuscript
- Category
- Components
Authors
Keyword
Latest Issue
Copyrights notice of machine-translated contents
The copyright of the original papers published on this site belongs to IEICE. Unauthorized use of the original or translated papers is prohibited. See IEICE Provisions on Copyright for details.
Cite this
Copy
Tohru KISHIMOTO, Yasuo KANEKO, "Cooling Characteristics of Small Planar Packaging System Combined with Card-On-Board Packaging for High-Speed Telecommunication Systems" in IEICE TRANSACTIONS on Electronics,
vol. E81-C, no. 10, pp. 1639-1647, October 1998, doi: .
Abstract: The small planar packaging (SPP) system described here can be combined with card-on-board (COB) packaging in high-speed asynchronous transfer mode (ATM) switching systems with throughput of over 40-Gb/s. The SPP system provides high I/O pin count density, high packaging density and high cooling capability. Prototype SPP system with air flow control structure for switching MCMs is constructed. Each MCM contained a 3
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e81-c_10_1639/_p
Copy
@ARTICLE{e81-c_10_1639,
author={Tohru KISHIMOTO, Yasuo KANEKO, },
journal={IEICE TRANSACTIONS on Electronics},
title={Cooling Characteristics of Small Planar Packaging System Combined with Card-On-Board Packaging for High-Speed Telecommunication Systems},
year={1998},
volume={E81-C},
number={10},
pages={1639-1647},
abstract={The small planar packaging (SPP) system described here can be combined with card-on-board (COB) packaging in high-speed asynchronous transfer mode (ATM) switching systems with throughput of over 40-Gb/s. The SPP system provides high I/O pin count density, high packaging density and high cooling capability. Prototype SPP system with air flow control structure for switching MCMs is constructed. Each MCM contained a 3
keywords={},
doi={},
ISSN={},
month={October},}
Copy
TY - JOUR
TI - Cooling Characteristics of Small Planar Packaging System Combined with Card-On-Board Packaging for High-Speed Telecommunication Systems
T2 - IEICE TRANSACTIONS on Electronics
SP - 1639
EP - 1647
AU - Tohru KISHIMOTO
AU - Yasuo KANEKO
PY - 1998
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E81-C
IS - 10
JA - IEICE TRANSACTIONS on Electronics
Y1 - October 1998
AB - The small planar packaging (SPP) system described here can be combined with card-on-board (COB) packaging in high-speed asynchronous transfer mode (ATM) switching systems with throughput of over 40-Gb/s. The SPP system provides high I/O pin count density, high packaging density and high cooling capability. Prototype SPP system with air flow control structure for switching MCMs is constructed. Each MCM contained a 3
ER -
English
