A New Low-Loss Microstrip Structure on LTCC Substrate
Summary :
We have devised and implemented a new low-loss microstrip transmission structure on LTCC substrate by including void cavities in the dielectric layer between conductor strip and ground plane. Measurements of λ/4 T-resonators with the novel microstrip structure reveal total loss of 0.0126dB/mm and Q-factor of 267 at 15.85GHz. The dielectric loss is analyzed as small as 0.0005dB/mm at the frequency, and that is equivalent to an improvement of a factor of 18 compared to the conventional LTCC microstrip structure. The proposed microstrip structure with the embedded void cavities is suited for low loss LTCC based RF-MCM applications.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E86-C No.5 pp.867-869
- Publication Date
- 2003/05/01
- Publicized
- Online ISSN
- DOI
- Type of Manuscript
- LETTER
- Category
- Microwaves, Millimeter-Waves
Authors
Keyword
Latest Issue
Copyrights notice of machine-translated contents
The copyright of the original papers published on this site belongs to IEICE. Unauthorized use of the original or translated papers is prohibited. See IEICE Provisions on Copyright for details.
Cite this
Copy
Young Chul LEE, Ki Chan EUN, Chul Soon PARK, "A New Low-Loss Microstrip Structure on LTCC Substrate" in IEICE TRANSACTIONS on Electronics,
vol. E86-C, no. 5, pp. 867-869, May 2003, doi: .
Abstract: We have devised and implemented a new low-loss microstrip transmission structure on LTCC substrate by including void cavities in the dielectric layer between conductor strip and ground plane. Measurements of λ/4 T-resonators with the novel microstrip structure reveal total loss of 0.0126dB/mm and Q-factor of 267 at 15.85GHz. The dielectric loss is analyzed as small as 0.0005dB/mm at the frequency, and that is equivalent to an improvement of a factor of 18 compared to the conventional LTCC microstrip structure. The proposed microstrip structure with the embedded void cavities is suited for low loss LTCC based RF-MCM applications.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e86-c_5_867/_p
Copy
@ARTICLE{e86-c_5_867,
author={Young Chul LEE, Ki Chan EUN, Chul Soon PARK, },
journal={IEICE TRANSACTIONS on Electronics},
title={A New Low-Loss Microstrip Structure on LTCC Substrate},
year={2003},
volume={E86-C},
number={5},
pages={867-869},
abstract={We have devised and implemented a new low-loss microstrip transmission structure on LTCC substrate by including void cavities in the dielectric layer between conductor strip and ground plane. Measurements of λ/4 T-resonators with the novel microstrip structure reveal total loss of 0.0126dB/mm and Q-factor of 267 at 15.85GHz. The dielectric loss is analyzed as small as 0.0005dB/mm at the frequency, and that is equivalent to an improvement of a factor of 18 compared to the conventional LTCC microstrip structure. The proposed microstrip structure with the embedded void cavities is suited for low loss LTCC based RF-MCM applications.},
keywords={},
doi={},
ISSN={},
month={May},}
Copy
TY - JOUR
TI - A New Low-Loss Microstrip Structure on LTCC Substrate
T2 - IEICE TRANSACTIONS on Electronics
SP - 867
EP - 869
AU - Young Chul LEE
AU - Ki Chan EUN
AU - Chul Soon PARK
PY - 2003
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E86-C
IS - 5
JA - IEICE TRANSACTIONS on Electronics
Y1 - May 2003
AB - We have devised and implemented a new low-loss microstrip transmission structure on LTCC substrate by including void cavities in the dielectric layer between conductor strip and ground plane. Measurements of λ/4 T-resonators with the novel microstrip structure reveal total loss of 0.0126dB/mm and Q-factor of 267 at 15.85GHz. The dielectric loss is analyzed as small as 0.0005dB/mm at the frequency, and that is equivalent to an improvement of a factor of 18 compared to the conventional LTCC microstrip structure. The proposed microstrip structure with the embedded void cavities is suited for low loss LTCC based RF-MCM applications.
ER -
English
